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TLK1201ARCPG4

Texas Instruments

TLK1201ARCPG4 by Texas Instruments

TLK1201ARCPG4 by Texas Instruments is an Ethernet transceiver with a data rate of 1250 Mbps. It operates at a supply voltage of 2.5V and has a max operating temperature of 70°C. This network interface IC is ideal for high-speed communication applications in commercial-grade environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,296 parts In-Stock

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Digiode

USA . 776 parts In-Stock

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776

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Parana Technologies

USA . 2,098 parts In-Stock

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$6.884

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$7.498

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2,098

$6.884

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$7.498

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AZTECH Wire

Italy . 460 parts In-Stock

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$7.408

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DigiPath Technology Company

USA . 281 parts In-Stock

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$7.580

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$6.974

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281

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$6.974

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ChromeModa Solutions

Germany . 5,621 parts In-Stock

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$7.735

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$6.343

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5,621

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$6.343

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IDEA Electronic Components Group

UK . 563 parts In-Stock

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$7.735

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$6.962

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563

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Component Stockers USA

USA . 507 parts In-Stock

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$99.990

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507

$99.990

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One Stop Electronics

USA . 1,502 parts In-Stock

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$238.000

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A-Z Elektronik GmbH

Germany . 5,082 parts In-Stock

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Corphita

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Microchip USA

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Overview

Experience the reliability and innovation of Texas Instruments with the TLK1201ARCPG4 Network Interface. Designed with cutting-edge technology, this Ethernet transceiver offers high-speed data rates of up to 1250 Mbps, making it ideal for a wide range of networking applications. With a durable plastic/epoxy body and a compact square shape, this device is easy to integrate into your network setup. Trust in the quality and expertise of Texas Instruments to deliver superior performance and efficiency. Upgrade your network infrastructure with the TLK1201ARCPG4 and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for electronic devices.

No. of Terminals: 64

Having 64 terminals allows for multiple connections and data transfer, increasing the versatility of the product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures that the product can withstand the rigors of manufacturing processes, increasing reliability.

Data Rate: 1250 Mbps

With a high data rate of 1250 Mbps, the product can facilitate fast and efficient data transmission, making it suitable for high-performance networking applications.

Technical Specifications

Network Interfaces TLK1201ARCPG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1201ARCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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