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TLK105LRHBT

Texas Instruments

TLK105LRHBT by Texas Instruments

TLK105LRHBT by Texas Instruments is a Network Interface with 4 Ethernet transceivers, operating at 100 Mbps. It has a temperature range of -40 to 85°C and features a chip carrier package style. Ideal for industrial applications requiring reliable network connectivity.

Median Price

$4.640

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

$2.000

100+ parts

$1.960

1k+ parts

$1.920

10k+ parts

-

3,000

$2.000

$1.960

$1.920

-

Chip1Stop

Japan . 1 parts In-Stock

1+ parts

$3.330

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$3.330

-

-

-

DigiKey

USA . 8,141 parts In-Stock

1+ parts

$5.950

100+ parts

$3.831

1k+ parts

$3.484

10k+ parts

$3.353

8,141

$5.950

$3.831

$3.484

$3.353

Mouser Electronics

USA . 210 parts In-Stock

1+ parts

$5.950

100+ parts

$3.840

1k+ parts

$3.380

10k+ parts

-

210

$5.950

$3.840

$3.380

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,238 parts In-Stock

1+ parts

$1.900

100+ parts

-

1k+ parts

-

10k+ parts

-

1,238

$1.900

-

-

-

Vyrian

USA . 172 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

172

$2.000

-

-

-

Chip Stock

USA . 3,262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,262

-

-

-

-

TME

Poland . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.564

10k+ parts

-

250

-

-

$3.564

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,354 parts In-Stock

1+ parts

$1.800

100+ parts

-

1k+ parts

-

10k+ parts

-

3,354

$1.800

-

-

-

Parana Technologies

USA . 947 parts In-Stock

1+ parts

$5.671

100+ parts

-

1k+ parts

$6.465

10k+ parts

-

947

$5.671

-

$6.465

-

ChromeModa Solutions

Germany . 3,298 parts In-Stock

1+ parts

$6.372

100+ parts

$5.225

1k+ parts

-

10k+ parts

-

3,298

$6.372

$5.225

-

-

IDEA Electronic Components Group

UK . 343 parts In-Stock

1+ parts

$6.372

100+ parts

-

1k+ parts

$5.735

10k+ parts

-

343

$6.372

-

$5.735

-

Lixinc

USA . 9,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,358

-

-

-

-

Authorized Procurement Solutions

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,500

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,670 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,670

-

-

-

-

Futuretech Components

Singapore . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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500

-

-

-

-

DigiPath Technology Company

USA . 321 parts In-Stock

1+ parts

-

100+ parts

$5.745

1k+ parts

-

10k+ parts

-

321

-

$5.745

-

-

Overview

Unlock the power of high-speed data transmission with the TLK105LRHBT by Texas Instruments. As a leader in network interfaces, Texas Instruments delivers top-quality products that guarantee reliability and performance. Ideal for Ethernet transceiver applications, this chip carrier package boasts four transceivers and a data rate of 100 Mbps. With an industrial temperature grade and moisture sensitivity level of 2, the TLK105LRHBT ensures seamless operation in any environment. Experience the value and benefits of cutting-edge technology with Texas Instruments.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards, saving time and cost during production.

Package Shape: SQUARE

Square packages offer efficient use of space on a circuit board, allowing for compact and streamlined designs.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for various components and peripherals, enhancing versatility in network setups.

Package Style: CHIP CARRIER

Chip carrier packages provide enhanced thermal performance and protection for delicate electronic components, improving reliability and longevity.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand demanding conditions and maintain performance without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures functionality in cold environments, making this product suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish offers excellent conductivity, corrosion resistance, and durability for long-term performance.

No. of Transceivers: 4

Having 4 transceivers allows for efficient data transmission and reception capabilities, enabling smooth and reliable network communication.

Nominal Supply Voltage: 1.55 V

The low nominal supply voltage helps reduce power consumption and heat generation, contributing to energy efficiency and cost savings.

Data Rate: 100 Mbps

Supporting a data rate of 100 Mbps ensures fast and reliable network connectivity for seamless data transfer and communication.

Technical Specifications

Network Interfaces TLK105LRHBT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

4

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Nominal Supply Voltage:

1.55 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TLK105LRHBT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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