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TLK1201ARCP

Texas Instruments

TLK1201ARCP by Texas Instruments

TLK1201ARCP by Texas Instruments is an Ethernet transceiver with a data rate of 1250 Mbps. It operates at 2.5V and has a max supply current of 0.09 mA. Ideal for network interfaces, this CMOS technology chip comes in a square package with 64 terminals and can withstand temperatures from 0 to 70°C.

Median Price

$6.100

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,884 parts In-Stock

1+ parts

-

100+ parts

$5.290

1k+ parts

$4.730

10k+ parts

$4.460

6,884

-

$5.290

$4.730

$4.460

DigiKey

USA . 6,308 parts In-Stock

1+ parts

-

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$6.100

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6,308

-

$6.100

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Verical

USA . 5,145 parts In-Stock

1+ parts

-

100+ parts

$6.612

1k+ parts

$5.912

10k+ parts

$5.575

5,145

-

$6.612

$5.912

$5.575

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 386 parts In-Stock

1+ parts

$5.576

100+ parts

-

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-

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386

$5.576

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Vyrian

USA . 1,854 parts In-Stock

1+ parts

$5.870

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-

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1,854

$5.870

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DigiKey Marketplace

USA . 7,429 parts In-Stock

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7,429

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Mil-Aero Solutions, Inc.

USA . 144 parts In-Stock

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144

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Resion

USA . 99 parts In-Stock

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99

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Goldney Electronics S.L.

Spain . 48 parts In-Stock

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48

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Semi Source

USA . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,768 parts In-Stock

1+ parts

$5.283

100+ parts

-

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4,768

$5.283

-

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Parana Technologies

USA . 1,481 parts In-Stock

1+ parts

$10.298

100+ parts

$956.343

1k+ parts

$9.268

10k+ parts

-

1,481

$10.298

$956.343

$9.268

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DigiPath Technology Company

USA . 73 parts In-Stock

1+ parts

$11.340

100+ parts

$10.432

1k+ parts

-

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73

$11.340

$10.432

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ChromeModa Solutions

Germany . 1,890 parts In-Stock

1+ parts

$11.571

100+ parts

$9.488

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-

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1,890

$11.571

$9.488

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IDEA Electronic Components Group

UK . 353 parts In-Stock

1+ parts

$11.571

100+ parts

$10.992

1k+ parts

$10.414

10k+ parts

-

353

$11.571

$10.992

$10.414

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$16.603

100+ parts

$15.109

1k+ parts

$13.614

10k+ parts

-

3,000

$16.603

$15.109

$13.614

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Microchip USA

USA . 287 parts In-Stock

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287

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Perfect Parts

USA . 263 parts In-Stock

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263

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Kepictronics

USA . 150 parts In-Stock

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150

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Overview

Experience seamless networking with the TLK1201ARCP by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality network interfaces that guarantee reliable connections for various applications. Whether you're looking to enhance your Ethernet transceiver or boost data rates up to 1250 Mbps, this product is designed to meet your needs. With a durable plastic/epoxy package body and nickel palladium gold terminal finish, the TLK1201ARCP offers outstanding value and performance. Upgrade your networking capabilities today with Texas Instruments!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the network interface, ensuring a longer lifespan.

No. of Terminals: 64

Offers a high number of terminals for connectivity, allowing for multiple connections to be made simultaneously.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, making it suitable for use in various environmental conditions.

Data Rate: 1250 Mbps

Delivers high-speed data transfer capabilities, ideal for applications that require fast and reliable network connections.

Technical Specifications

Network Interfaces TLK1201ARCP attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1201ARCP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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