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TLK1201AIRCPG4

Texas Instruments

TLK1201AIRCPG4 by Texas Instruments

TLK1201AIRCPG4 by Texas Instruments is an Ethernet transceiver with data rate of 1250 Mbps. It operates at 2.5V, has 64 terminals in a square package shape, and can withstand temperatures from -40 to 85 °C. Ideal for network interfaces in industrial applications.

Median Price

$6.000

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 150 parts In-Stock

1+ parts

$6.000

100+ parts

$5.880

1k+ parts

$5.760

10k+ parts

-

150

$6.000

$5.880

$5.760

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,744 parts In-Stock

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8,744

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Semi Source

USA . 1,739 parts In-Stock

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1,739

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Digiode

USA . 735 parts In-Stock

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735

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Distributors (Availability)

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AZTECH Wire

Italy . 481 parts In-Stock

1+ parts

$12.782

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481

$12.782

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Parana Technologies

USA . 255 parts In-Stock

1+ parts

$13.800

100+ parts

-

1k+ parts

$14.286

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255

$13.800

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$14.286

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ChromeModa Solutions

Germany . 3,948 parts In-Stock

1+ parts

$15.506

100+ parts

$12.715

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3,948

$15.506

$12.715

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IDEA Electronic Components Group

UK . 1,295 parts In-Stock

1+ parts

$15.506

100+ parts

$14.731

1k+ parts

$13.955

10k+ parts

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1,295

$15.506

$14.731

$13.955

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One Stop Electronics

USA . 128 parts In-Stock

1+ parts

$478.000

100+ parts

-

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128

$478.000

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Microchip USA

USA . 5,756 parts In-Stock

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5,756

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Kepictronics

USA . 2,139 parts In-Stock

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2,139

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DigiPath Technology Company

USA . 1,926 parts In-Stock

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100+ parts

$13.980

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1,926

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$13.980

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Corphita

USA . 1,815 parts In-Stock

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1,815

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Overview

Experience unparalleled connectivity with the TLK1201AIRCPG4 by Texas Instruments. As a leader in network interfaces, Texas Instruments delivers exceptional quality and reliability in every product. The TLK1201AIRCPG4 offers seamless integration, high-speed data transfer capabilities, and industrial-grade performance for a wide range of applications. Stay ahead of the curve with this cutting-edge Ethernet transceiver, providing customers with unmatched value, efficiency, and innovation in their networking needs. Elevate your connectivity experience with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Being surface mountable makes the installation process easier and more convenient, saving time and effort during assembly.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C allows the product to function effectively even in challenging environments without overheating.

Data Rate: 1250 Mbps

With a high data rate of 1250 Mbps, this product enables fast and efficient data transmission, ideal for high-speed networking applications.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 indicates that the product can withstand moderate levels of moisture exposure, ensuring reliability in various environmental conditions.

Technical Specifications

Network Interfaces TLK1201AIRCPG4 attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

1250 Mbps

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.09 mA

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TLK1201AIRCPG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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