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TLK106RHBT

Texas Instruments

TLK106RHBT by Texas Instruments

TLK106RHBT by Texas Instruments is an Ethernet transceiver with 100 Mbps data rate, operating at -40 to 105°C. It has 32 terminals in a square chip carrier package style, suitable for industrial telecom applications. The IC supports power supplies of 1.55-3.3V and features a moisture sensitivity level of MSL2.

Median Price

$6.070

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 11,213 parts In-Stock

1+ parts

$6.070

100+ parts

$3.920

1k+ parts

$3.490

10k+ parts

-

11,213

$6.070

$3.920

$3.490

-

DigiKey

USA . 626 parts In-Stock

1+ parts

$6.070

100+ parts

$3.915

1k+ parts

$3.562

10k+ parts

$3.429

626

$6.070

$3.915

$3.562

$3.429

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Greenchips

USA . 1,997 parts In-Stock

1+ parts

$3.334

100+ parts

$3.175

1k+ parts

$3.024

10k+ parts

$2.729

1,997

$3.334

$3.175

$3.024

$2.729

Nova Conductors

Japan . 84 parts In-Stock

1+ parts

$3.569

100+ parts

-

1k+ parts

-

10k+ parts

-

84

$3.569

-

-

-

Digiode

USA . 3,165 parts In-Stock

1+ parts

$4.484

100+ parts

-

1k+ parts

-

10k+ parts

-

3,165

$4.484

-

-

-

Vyrian

USA . 6,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,062

-

-

-

-

SIE Connect GmbH - GreenChips

Germany . 2,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,608

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,887 parts In-Stock

1+ parts

$3.569

100+ parts

-

1k+ parts

-

10k+ parts

$3.498

2,887

$3.569

-

-

$3.498

Argo Parts USA

USA . 712 parts In-Stock

1+ parts

$3.569

100+ parts

-

1k+ parts

-

10k+ parts

-

712

$3.569

-

-

-

Corphita

USA . 2,986 parts In-Stock

1+ parts

$4.248

100+ parts

-

1k+ parts

-

10k+ parts

-

2,986

$4.248

-

-

-

Ampacity Inc.

Singapore . 6,003 parts In-Stock

1+ parts

$4.550

100+ parts

-

1k+ parts

-

10k+ parts

-

6,003

$4.550

-

-

-

Corohmni

South Africa . 15 parts In-Stock

1+ parts

$8.188

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$8.188

-

-

-

Parana Technologies

USA . 1,572 parts In-Stock

1+ parts

$12.721

100+ parts

-

1k+ parts

$13.186

10k+ parts

-

1,572

$12.721

-

$13.186

-

DigiPath Technology Company

USA . 1,105 parts In-Stock

1+ parts

$14.007

100+ parts

$12.887

1k+ parts

-

10k+ parts

-

1,105

$14.007

$12.887

-

-

ChromeModa Solutions

Germany . 4,003 parts In-Stock

1+ parts

$14.293

100+ parts

$11.720

1k+ parts

-

10k+ parts

-

4,003

$14.293

$11.720

-

-

IDEA Electronic Components Group

UK . 677 parts In-Stock

1+ parts

$14.293

100+ parts

$13.578

1k+ parts

$12.864

10k+ parts

-

677

$14.293

$13.578

$12.864

-

Perfect Parts

USA . 6,716 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,716

-

-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$3.498

1k+ parts

$3.391

10k+ parts

$3.319

1,000

-

$3.498

$3.391

$3.319

Overview

Experience seamless and reliable networking with the TLK106RHBT by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge solutions in the Network Interfaces category. This versatile product offers a wide range of applications and benefits, providing customers with unparalleled value and performance. Stay connected effortlessly with the TLK106RHBT and elevate your networking experience today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the network interface easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components, contributing to a streamlined manufacturing process.

Power Supplies (V): 1.55,3.3

This dual power supply option provides flexibility in power management, allowing for compatibility with different power sources.

No. of Terminals: 32

With a high number of terminals, this network interface can support multiple connections and data transfer channels simultaneously.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles offer different benefits such as enhanced heat dissipation and compact design, catering to different usage scenarios.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures stable performance even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of these high-quality materials for terminal finish ensures excellent connectivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position enables efficient data transmission and reception, enhancing the overall performance of the network interface.

Maximum Seated Height: 1 mm

The low seated height contributes to a slim profile, making the network interface suitable for compact and space-constrained installations.

Width: 5 mm

The narrow width allows for easy integration into existing systems without taking up too much space.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Length: 5 mm

The compact length adds to the overall space-saving design of the network interface.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature tolerance ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and compliant with current regulations, making it a sustainable choice.

Telecom IC Type: ETHERNET TRANSCEIVER

This specific type of telecom IC is designed for high-speed data transmission over Ethernet networks, making it ideal for networking applications.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage ensures compatibility with standard power sources, simplifying integration into existing systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting of components, maximizing connectivity within a limited space.

Data Rate: 100 Mbps

The high data rate of 100 Mbps enables fast and efficient data transfer, crucial for network performance.

Moisture Sensitivity Level (MSL): 2

The moderate moisture sensitivity level ensures that the network interface is robust against moisture-related damage, increasing its reliability.

Technical Specifications

Network Interfaces TLK106RHBT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.55,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TLK106RHBT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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