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TLK105RHBT

Texas Instruments

TLK105RHBT by Texas Instruments

TLK105RHBT by Texas Instruments is an Ethernet transceiver with a data rate of 100 Mbps. It operates at temperatures ranging from -40 to 85 °C and has a supply voltage of 3.3 V. Ideal for network interfaces, this chip carrier package with 32 terminals is surface mountable and suitable for industrial applications.

Median Price

$5.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,169 parts In-Stock

1+ parts

$5.360

100+ parts

$3.431

1k+ parts

$3.115

10k+ parts

$2.996

1,169

$5.360

$3.431

$3.115

$2.996

Mouser Electronics

USA . 238 parts In-Stock

1+ parts

$5.960

100+ parts

$3.790

1k+ parts

$3.320

10k+ parts

-

238

$5.960

$3.790

$3.320

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 579 parts In-Stock

1+ parts

$4.256

100+ parts

-

1k+ parts

-

10k+ parts

-

579

$4.256

-

-

-

Vyrian

USA . 151 parts In-Stock

1+ parts

$4.480

100+ parts

-

1k+ parts

-

10k+ parts

-

151

$4.480

-

-

-

TME

Poland . 3,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$4.053

10k+ parts

-

3,500

-

-

$4.053

-

Speed Components Ltd

Israel . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,677 parts In-Stock

1+ parts

$4.032

100+ parts

-

1k+ parts

-

10k+ parts

-

3,677

$4.032

-

-

-

Parana Technologies

USA . 85 parts In-Stock

1+ parts

$10.823

100+ parts

$1,005.107

1k+ parts

$9.741

10k+ parts

-

85

$10.823

$1,005.107

$9.741

-

DigiPath Technology Company

USA . 802 parts In-Stock

1+ parts

$11.918

100+ parts

$10.964

1k+ parts

-

10k+ parts

-

802

$11.918

$10.964

-

-

ChromeModa Solutions

Germany . 4,767 parts In-Stock

1+ parts

$12.161

100+ parts

$9.972

1k+ parts

-

10k+ parts

-

4,767

$12.161

$9.972

-

-

IDEA Electronic Components Group

UK . 1,720 parts In-Stock

1+ parts

$12.161

100+ parts

$11.553

1k+ parts

$10.945

10k+ parts

-

1,720

$12.161

$11.553

$10.945

-

Microchip USA

USA . 183 parts In-Stock

1+ parts

$20.670

100+ parts

$20.610

1k+ parts

$20.610

10k+ parts

$20.540

183

$20.670

$20.610

$20.610

$20.540

Overview

Elevate your network connectivity with the TLK105RHBT by Texas Instruments, a top-tier Ethernet transceiver designed for industrial-grade applications. Crafted with precision and expertise by Texas Instruments, this chip carrier package provides reliable and efficient networking solutions. With a maximum data rate of 100 Mbps and a nominal supply voltage of 3.3V, this cutting-edge device ensures seamless communication within your network infrastructure. Say goodbye to connectivity issues and embrace the future of networking with the TLK105RHBT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the product lightweight and durable, ideal for networking devices that may be moved or transported frequently.

Surface Mount: YES

Being surface mountable makes it easier to integrate this network interface into a variety of electronic devices, saving space and simplifying assembly processes.

Power Supplies (V): 1.55,3.3

The availability of multiple power supply options (1.55V and 3.3V) provides flexibility in designing and powering the network interface according to specific requirements.

No. of Terminals: 32

With a high number of terminals, this network interface can support complex networking protocols and connections, allowing for efficient data transfer.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding industrial environments where temperatures can fluctuate.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C guarantees that the network interface can function effectively in extreme cold conditions without any performance issues.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold as terminal finishes provides excellent conductivity and corrosion resistance, ensuring long-term reliability of the network interface.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage of 3.3V ensures consistent and efficient operation of the network interface, preventing voltage fluctuations that could affect performance.

Data Rate: 100 Mbps

The high data rate of 100 Mbps enables fast and efficient data transmission, making it suitable for high-speed networking applications that require quick data transfer.

Technical Specifications

Network Interfaces TLK105RHBT attributes and parameters. Explore more Network Interfaces devices from Texas Instruments

Specs

Data Rate:

100 Mbps

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.55,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Network Interfaces

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

TLK105RHBT Telecommunications trade compliance attributes, and parameters.

ECCN

5A991.B.1

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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