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TJA1050T/N,118

NXP Semiconductors

TJA1050T/N,118 by NXP Semiconductors

NXP Semiconductors' TJA1050T/N,118 is a CMOS interface circuit with 1 Mbps data rate and 5V nominal voltage. It is designed for automotive applications, featuring a small outline package with 8 terminals and operating temperatures ranging from -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,448 parts In-Stock

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Digiode

USA . 2,166 parts In-Stock

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Anansix

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Nova Conductors

Japan . 72 parts In-Stock

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AZTECH Wire

Italy . 491 parts In-Stock

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$7.625

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Corohmni

South Africa . 52 parts In-Stock

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$15.962

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Aztec Data Supply Inc.

USA . 283 parts In-Stock

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$17.600

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One Stop Electronics

USA . 997 parts In-Stock

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$201.000

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Ampacity Inc.

Singapore . 191 parts In-Stock

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$222.000

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Semicontronic

India . 963 parts In-Stock

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$657.000

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$640.575

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$637.290

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QUARKTWIN TECHNOLOGY LTD

USA . 11,898 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 3,271 parts In-Stock

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UNI Independent Distributors

Spain . 2,740 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Bastille Electronics

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Argo Parts USA

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Overview

Experience seamless networking with the TJA1050T/N,118 by NXP Semiconductors. This top-quality network interface offers unparalleled reliability and performance in a compact package, making it ideal for automotive applications. With a wide operating temperature range and low power consumption, this interface circuit delivers exceptional value and efficiency. Trust NXP Semiconductors for cutting-edge technology that meets your connectivity needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material makes the product lightweight and durable, ideal for use in various applications.

Surface Mount: YES

Surface mount capability allows for easy and secure installation on circuit boards, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular package shape provides a standardized form factor, making it compatible with a wide range of devices and systems.

Power Supplies (V): 5

Operates on a standard 5V power supply, ensuring compatibility with most systems and power sources.

No. of Terminals: 8

Eight terminals provide ample connectivity options and flexibility for various input and output configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it suitable for compact electronic devices.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures the product can withstand cold temperatures without compromising functionality.

Terminal Position: DUAL

Dual terminal position offers multiple connection options, enhancing versatility and ease of integration.

Maximum Seated Height: 1.75 mm

Low maximum seated height minimizes the overall profile of the product, making it suitable for slim and compact designs.

Width: 3.9 mm

Compact width dimension enables the product to fit into tight spaces and narrow layouts without sacrificing performance.

Length: 4.9 mm

Short length dimension ensures the product can be accommodated in space-constrained applications without compromising functionality.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature tolerance means the product is designed to withstand harsh conditions commonly encountered in automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable in various operating conditions.

Terminal Form: GULL WING

Gull wing terminal form provides secure and stable connections, reducing the risk of signal loss or disconnection during operation.

Maximum Supply Current: 0.075 mA

Low maximum supply current minimizes power consumption, enabling energy-efficient operation and reducing overall system costs.

Telecom IC Type: INTERFACE CIRCUIT

Interface circuit design allows for seamless integration with different telecom devices and systems, ensuring reliable communication and data transfer.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with most power sources and electronic systems, simplifying installation and operation.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27mm facilitates easy connection and alignment during assembly, reducing the risk of errors or misalignments.

Data Rate: 1 Mbps

High data rate of 1 Mbps enables fast and efficient data transfer, making the product suitable for high-performance networking applications.

Technical Specifications

Network Interfaces TJA1050T/N,118 attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Network Interfaces

Maximum Supply Current:

.075 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

TJA1050T/N,118 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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