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TLC5540IPWRG4

Texas Instruments

TLC5540IPWRG4 by Texas Instruments

TLC5540IPWRG4 by Texas Instruments is an 8-bit ADC with 40 MHz sample rate, 0.3906% linearity error, and 5V supply voltage. Ideal for industrial applications requiring high-speed analog-to-digital conversion in a compact package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,555 parts In-Stock

1+ parts

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6,555

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Digiode

USA . 4,119 parts In-Stock

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4,119

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Distributors (Availability)

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One Stop Electronics

USA . 1,229 parts In-Stock

1+ parts

$5.000

100+ parts

-

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1,229

$5.000

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AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$14.617

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581

$14.617

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Parana Technologies

USA . 922 parts In-Stock

1+ parts

$21.529

100+ parts

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$21.915

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922

$21.529

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$21.915

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DigiPath Technology Company

USA . 515 parts In-Stock

1+ parts

$23.706

100+ parts

$21.810

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515

$23.706

$21.810

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IDEA Electronic Components Group

UK . 1,946 parts In-Stock

1+ parts

$24.190

100+ parts

$22.980

1k+ parts

$21.771

10k+ parts

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1,946

$24.190

$22.980

$21.771

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ChromeModa Solutions

Germany . 1,540 parts In-Stock

1+ parts

$24.190

100+ parts

$19.836

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1,540

$24.190

$19.836

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Corphita

USA . 3,875 parts In-Stock

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3,875

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Kepictronics

USA . 550 parts In-Stock

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550

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Microchip USA

USA . 265 parts In-Stock

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265

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Overview

Unlock the full potential of your analog-to-digital conversion needs with the TLC5540IPWRG4 by Texas Instruments. With a commitment to quality and innovation, Texas Instruments delivers a superior product that promises precision and reliability. Ideal for industrial applications, this 8-bit ADC boasts a fast sample rate of 40 MHz and a compact design for easy integration. Experience the value and benefits of the TLC5540IPWRG4, where efficiency meets performance, making it the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material ensuring product longevity

No. of Bits: 8

Provides a high-resolution output for accurate digital conversion

Maximum Linearity Error (EL): 0.3906%

Ensures precise conversion of analog signals to digital without significant error

Sample Rate: 40 MHz

High sample rate allows for rapid conversion of analog signals

Technology: CMOS

Utilizes low power consumption and provides high noise immunity for reliable operation

Maximum Analog Input Voltage: 5.25 V

Accepts a wide range of input voltages for versatile use

Output Format: PARALLEL, 8 BITS

Outputs data in parallel format with 8-bit resolution for easy integration with other systems

Technical Specifications

Analog-to-Digital Converters TLC5540IPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

40 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

2

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.307 in (7.8 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP24,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC5540IPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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