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TLC5540CPWRG4

Texas Instruments

TLC5540CPWRG4 by Texas Instruments

TLC5540CPWRG4 by Texas Instruments is an 8-bit ADC with 40 MHz sample rate, 0.3906% linearity error, and 5V supply. It is used in applications requiring high-speed analog-to-digital conversion like industrial automation and data acquisition systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,755 parts In-Stock

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4,755

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Vyrian

USA . 2,354 parts In-Stock

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2,354

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Distributors (Availability)

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AZTECH Wire

Italy . 395 parts In-Stock

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$5.811

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395

$5.811

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Parana Technologies

USA . 1,954 parts In-Stock

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$11.657

100+ parts

$1,082.550

1k+ parts

$10.491

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1,954

$11.657

$1,082.550

$10.491

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DigiPath Technology Company

USA . 2,059 parts In-Stock

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$12.836

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2,059

$12.836

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ChromeModa Solutions

Germany . 6,201 parts In-Stock

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$13.098

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$10.740

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6,201

$13.098

$10.740

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IDEA Electronic Components Group

UK . 215 parts In-Stock

1+ parts

$13.098

100+ parts

$12.443

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$11.788

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215

$13.098

$12.443

$11.788

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Ampacity Inc.

Singapore . 526 parts In-Stock

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$15.000

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526

$15.000

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One Stop Electronics

USA . 172 parts In-Stock

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$32.000

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172

$32.000

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Corphita

USA . 745 parts In-Stock

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745

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Kepictronics

USA . 200 parts In-Stock

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200

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Microchip USA

USA . 140 parts In-Stock

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Overview

Experience unparalleled precision and reliability with the TLC5540CPWRG4 by Texas Instruments, a leading manufacturer in the industry. As part of the Analog-to-Digital Converters category, this product offers exceptional quality and performance, making it ideal for a wide range of applications. From industrial automation to medical devices, the TLC5540CPWRG4 provides value beyond measure with its superior accuracy and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TLC5540CPWRG4 and discover the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the converter.

No. of Bits: 8

Offers a decent resolution for converting analog signals to digital values.

Maximum Linearity Error (EL): 0.3906%

Ensures accuracy in converting analog signals to digital values.

Power Supplies (V): 5

Compatible with standard 5V power supplies for ease of integration.

Maximum Operating Temperature: 70 °C

Can withstand relatively high temperatures for reliable performance in various environments.

Sample Rate: 40 MHz

High sample rate allows for capturing fast-changing analog signals accurately.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Output Format: PARALLEL, 8 BITS

Provides data in a convenient parallel format suitable for further processing.

Sample and Hold/Track and Hold: SAMPLE

Sample and hold functionality ensures accurate conversion of analog signals.

Technical Specifications

Analog-to-Digital Converters TLC5540CPWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Parallel, 8 Bits

Maximum Linearity Error (EL):

0.3906 %

Sample Rate:

40 MHz

Hold Mode:

Sample

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.25 V

Nominal Supply Voltage:

5 V

Operating Conditions

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Form Factor

Terminal Position:

Dual

No. of Terminals:

24

Terminal Form:

Terminal Pitch:

0.026 in (0.65 mm)

Surface Mount:

Yes

Width:

0.173 in (4.4 mm)

Length:

0.307 in (7.8 mm)

Maximum Seated Height:

0.047 in (1.2 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline, Thin Profile, Shrink Pitch

Package Shape:

Package Equivalence Code:

TSSOP24,.25

Package Code:

Standards and Codes

JESD-30 Code:

R-PDSO-G24

Qualified:

No

Trade Compliance

TLC5540CPWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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