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TLC549CDRG4

Texas Instruments

TLC549CDRG4 by Texas Instruments

TLC549CDRG4 by Texas Instruments is an 8-bit ADC with 0.1953% EL, 17us conversion time, and 0.04MHz sample rate. Ideal for commercial applications requiring a small outline package, it operates b/w 0-70°C with a max analog input voltage of 6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,876 parts In-Stock

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6,876

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Digiode

USA . 4,016 parts In-Stock

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4,016

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Chip Stock

USA . 3,390 parts In-Stock

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3,390

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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AZTECH Wire

Italy . 699 parts In-Stock

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$8.014

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699

$8.014

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Parana Technologies

USA . 2,168 parts In-Stock

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$11.199

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$1,039.985

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$10.079

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2,168

$11.199

$1,039.985

$10.079

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DigiPath Technology Company

USA . 295 parts In-Stock

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$12.331

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295

$12.331

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

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$12.583

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$11.954

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$11.325

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2,156

$12.583

$11.954

$11.325

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ChromeModa Solutions

Germany . 370 parts In-Stock

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$12.583

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$10.318

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370

$12.583

$10.318

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One Stop Electronics

USA . 786 parts In-Stock

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$24.000

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786

$24.000

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Ampacity Inc.

Singapore . 1,574 parts In-Stock

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$36.000

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1,574

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Component Stockers USA

USA . 549 parts In-Stock

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$99.990

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549

$99.990

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Kepictronics

USA . 12,340 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,544 parts In-Stock

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Corphita

USA . 4,354 parts In-Stock

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Microchip USA

USA . 183 parts In-Stock

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183

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Unlock the power of precise analog-to-digital conversion with the TLC549CDRG4 by Texas Instruments. Crafted with top-quality materials and cutting-edge technology, this ADC offers unmatched accuracy and reliability. Ideal for a wide range of applications, this converter provides seamless integration and fast conversion times. Experience the value of superior performance and efficiency with Texas Instruments' TLC549CDRG4 - the ultimate solution for your analog-to-digital needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and facilitating automated assembly.

No. of Bits: 8

Provides sufficient resolution for many applications while keeping the cost and complexity low.

Maximum Linearity Error (EL): 0.1953%

Ensures high accuracy of conversion, making the product suitable for precision measurement applications.

Maximum Analog Input Voltage: 6 V

Supports a wide range of input voltages, making the product versatile and compatible with different signal sources.

Sample Rate: 0.04 MHz

The high sample rate allows for fast and efficient conversion of analog signals, useful in real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type provides a good balance between speed and accuracy, making it suitable for a wide range of applications.

Technical Specifications

Analog-to-Digital Converters TLC549CDRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC549CDRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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