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TLC549CDG4

Texas Instruments

TLC549CDG4 by Texas Instruments

TLC549CDG4 by Texas Instruments is an 8-bit ADC with 0.1953% max linearity error, 17us conversion time, and 0-6V analog input range. Ideal for commercial applications requiring precise analog-to-digital conversion in a compact package.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 583 parts In-Stock

1+ parts

$1.940

100+ parts

$1.900

1k+ parts

$1.860

10k+ parts

-

583

$1.940

$1.900

$1.860

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,271 parts In-Stock

1+ parts

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7,271

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Digiode

USA . 3,985 parts In-Stock

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3,985

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Avant Electronics Limited

UK . 47 parts In-Stock

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47

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 845 parts In-Stock

1+ parts

$7.734

100+ parts

-

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845

$7.734

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Parana Technologies

USA . 1,162 parts In-Stock

1+ parts

$14.111

100+ parts

-

1k+ parts

$14.576

10k+ parts

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1,162

$14.111

-

$14.576

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DigiPath Technology Company

USA . 1,540 parts In-Stock

1+ parts

$15.538

100+ parts

$14.295

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-

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1,540

$15.538

$14.295

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ChromeModa Solutions

Germany . 4,952 parts In-Stock

1+ parts

$15.855

100+ parts

$13.001

1k+ parts

-

10k+ parts

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4,952

$15.855

$13.001

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IDEA Electronic Components Group

UK . 170 parts In-Stock

1+ parts

$15.855

100+ parts

$15.062

1k+ parts

$14.270

10k+ parts

-

170

$15.855

$15.062

$14.270

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One Stop Electronics

USA . 989 parts In-Stock

1+ parts

$17.000

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989

$17.000

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Component Stockers USA

USA . 684 parts In-Stock

1+ parts

$99.990

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684

$99.990

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Corphita

USA . 3,564 parts In-Stock

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3,564

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Microchip USA

USA . 287 parts In-Stock

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287

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Overview

Texas Instruments, a renowned manufacturer of high-quality electronic components, presents the TLC549CDG4 Analog-to-Digital Converter. This innovative product offers precise conversion with minimal linearity error, making it ideal for a wide range of applications. From industrial automation to medical devices, this small outline package provides fast and accurate results, ensuring reliable performance in any project. Trust Texas Instruments for top-notch technology that delivers value and efficiency to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight, durable, and provides good protection for the sensitive components inside the ADC.

No. of Bits: 8

Provides high resolution for accurate conversion of analog signals into digital data.

Maximum Linearity Error (EL): 0.1953 %

Ensures precision in converting analog signals with minimal error.

Maximum Operating Temperature: 70 °C

Can operate effectively in a wide range of temperatures, making it versatile for various applications.

Maximum Conversion Time: 17 us

Offers fast conversion time, making it suitable for applications requiring rapid data acquisition.

Technology: CMOS

CMOS technology ensures low power consumption and high integration, making it efficient for use in various devices.

Nominal Supply Voltage: 5 V

Compatible with standard power sources, ensuring easy integration into existing systems.

Technical Specifications

Analog-to-Digital Converters TLC549CDG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC549CDG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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