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TLC549CD

Texas Instruments

TLC549CD by Texas Instruments

TLC549CD by Texas Instruments is an 8-bit ADC with 0.1953% EL, 17us conversion time, and 0.04MHz sample rate. Ideal for commercial applications, it features a small outline package, operates b/w 0-70°C, and has a max analog input voltage of 6V.

Median Price

$1.940

Lifecycle Status

Suppliers In-Stock

27

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 9,944 parts In-Stock

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$1.940

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$1.900

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$1.860

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Forefront Electronics and Design

USA . 18 parts In-Stock

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Vyrian

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Sinequanon

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Bristol Electronics

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Digiode

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Mil-Aero Solutions, Inc.

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Corel Iberica Componentes, S.L.

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Electronic Expediters

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Goldney Electronics S.L.

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R&J Components

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Sea View Technologies

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First Choice Components Inc.

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ComSIT Distribution GmbH

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Bas Electronics GmbH & Co. KG

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Pegasus Components GmbH

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ABC Electronics Ltd.

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LIBRA Elektronik GmbH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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MISTER SPROCKETS

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Inventory MP

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Ashlea Components Ltd

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ACDS - Activité Composants Distribution Service

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Netsource Technology, Inc.

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Component Sense

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Sogenti Electronics

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One Stop Electronics

USA . 601 parts In-Stock

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AZTECH Wire

Italy . 880 parts In-Stock

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Parana Technologies

USA . 1,706 parts In-Stock

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DigiPath Technology Company

USA . 1,703 parts In-Stock

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ChromeModa Solutions

Germany . 2,571 parts In-Stock

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IDEA Electronic Components Group

UK . 1,832 parts In-Stock

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Corphita

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Computer Components Inc. - USA

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A-Z Elektronik GmbH

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iodParts Technologies Inc.

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Cyclops Electronics Ltd (Excess)

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Overview

Experience unparalleled precision and reliability with the TLC549CD by Texas Instruments, a leader in Analog-to-Digital Converters. This high-quality product offers a seamless transition from analog to digital signals, making it ideal for a wide range of applications. Whether you are designing industrial control systems or medical instruments, the TLC549CD provides exceptional value with its fast conversion time, low linearity error, and wide operating temperature range. Trust Texas Instruments for cutting-edge technology that delivers unmatched performance and efficiency. Elevate your projects with the TLC549CD today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the converter, ensuring durability and reliability.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

No. of Bits: 8

Offers a decent resolution for converting analog signals to digital values with sufficient accuracy.

Maximum Linearity Error (EL): 0.1953 %

Ensures high precision in converting analog signals to digital values, resulting in accurate measurements.

Maximum Operating Temperature: 70 °C

Can operate efficiently within a wide temperature range, making it suitable for various environments.

Maximum Conversion Time: 17 us

Provides fast conversion speed, allowing for quick processing of analog signals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance of the converter.

Output Format: SERIAL

Serial output format enables easy interfacing with microcontrollers and other digital systems for further processing of the converted data.

Technical Specifications

Analog-to-Digital Converters TLC549CD attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

1

No. of Functions:

1

No. of Bits:

8

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

6 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

8

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.154 in (3.9 mm)

Length:

0.193 in (4.9 mm)

Maximum Seated Height:

0.069 in (1.75 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G8

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC549CD Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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