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TLC542IFNG3

Texas Instruments

TLC542IFNG3 by Texas Instruments

TLC542IFNG3 by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 5V power supply. Ideal for industrial applications, it offers a sample rate of 0.04 MHz and operates at temperatures ranging from -40 to 85°C.

Median Price

$2.090

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 110 parts In-Stock

1+ parts

-

100+ parts

$2.090

1k+ parts

$1.870

10k+ parts

$1.760

110

-

$2.090

$1.870

$1.760

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,660 parts In-Stock

1+ parts

$2.204

100+ parts

-

1k+ parts

-

10k+ parts

-

2,660

$2.204

-

-

-

Vyrian

USA . 7,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,082

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,390 parts In-Stock

1+ parts

$2.088

100+ parts

-

1k+ parts

-

10k+ parts

-

2,390

$2.088

-

-

-

Parana Technologies

USA . 443 parts In-Stock

1+ parts

$14.621

100+ parts

$1,357.774

1k+ parts

$13.159

10k+ parts

-

443

$14.621

$1,357.774

$13.159

-

DigiPath Technology Company

USA . 690 parts In-Stock

1+ parts

$16.099

100+ parts

$14.811

1k+ parts

-

10k+ parts

-

690

$16.099

$14.811

-

-

ChromeModa Solutions

Germany . 3,254 parts In-Stock

1+ parts

$16.428

100+ parts

$13.471

1k+ parts

-

10k+ parts

-

3,254

$16.428

$13.471

-

-

IDEA Electronic Components Group

UK . 34 parts In-Stock

1+ parts

$16.428

100+ parts

$15.607

1k+ parts

$14.785

10k+ parts

-

34

$16.428

$15.607

$14.785

-

AZTECH Wire

Italy . 1,009 parts In-Stock

1+ parts

$21.920

100+ parts

-

1k+ parts

-

10k+ parts

-

1,009

$21.920

-

-

-

Advanced Electronics

New Zealand . 50 parts In-Stock

1+ parts

$29.705

100+ parts

$27.032

1k+ parts

$24.358

10k+ parts

-

50

$29.705

$27.032

$24.358

-

Microchip USA

USA . 1,577 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,577

-

-

-

-

Perfect Parts

USA . 123 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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123

-

-

-

-

Overview

Unlock the power of precision with the TLC542IFNG3 by Texas Instruments. Crafted with expertise and innovation, this Analog-to-Digital Converter offers unparalleled accuracy and reliability in a compact package. Perfect for industrial applications, this chip carrier delivers 8 bits of data with a conversion time of just 20 microseconds. Trust Texas Instruments to provide cutting-edge technology that meets your needs with ease. Upgrade to the TLC542IFNG3 and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components of the ADC, making it suitable for industrial applications.

No. of Analog In Channels: 11

With 11 analog input channels, this ADC offers flexibility in terms of monitoring multiple analog signals simultaneously, providing versatility in various measurement and control systems.

Surface Mount: YES

The surface mount capability simplifies the PCB assembly process and saves space, making it ideal for space-constrained designs and mass production.

No. of Bits: 8

The 8-bit resolution ensures precise digital conversion of analog signals, offering adequate accuracy for most applications while maintaining cost-effectiveness.

Maximum Linearity Error (EL): 0.1953 %

The low linearity error ensures high accuracy in converting analog signals to digital, resulting in reliable and precise data acquisition.

Power Supplies (V): 5

Operating at a standard voltage of 5V, this ADC is compatible with common power sources, simplifying integration into existing systems and reducing the need for additional components.

No. of Terminals: 20

With 20 terminals, this ADC provides sufficient connectivity options and flexibility for interfacing with external devices, enabling versatile system integration.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and ease of installation on PCBs, making it suitable for applications where space-saving is critical.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range allows the ADC to function reliably in harsh industrial environments without compromising performance, ensuring durability and longevity.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range enables the ADC to operate in extreme cold conditions, making it suitable for use in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures stable electrical contact, enhancing the reliability and longevity of the ADC in varied operating conditions.

Terminal Position: QUAD

The quad terminal position facilitates easy mounting and soldering on the PCB, simplifying the assembly process and ensuring secure connections for dependable performance.

Maximum Conversion Time: 20 us

The fast conversion time of 20 microseconds enables quick and efficient analog-to-digital conversion, making the ADC suitable for real-time applications that require rapid data processing.

Maximum Seated Height: 4.57 mm

The low seated height of 4.57 mm saves space on the PCB and allows for compact system designs, making the ADC ideal for applications with stringent size constraints.

Width: 8.965 mm

The moderate width of 8.965 mm ensures compatibility with standard PCB layouts and makes it easy to integrate the ADC into various electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum reflow time of 30 seconds at peak temperature ensures proper soldering of the ADC onto the PCB, preventing soldering defects and ensuring reliable electrical connections.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for the safe and effective soldering of the ADC during the manufacturing process, ensuring robust solder joints for stable operation.

Length: 8.965 mm

The length of 8.965 mm enables easy integration of the ADC into standard PCB layouts, providing compatibility with existing electronic systems and facilitating seamless system design.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation of the ADC in harsh environmental conditions commonly found in industrial applications, making it suitable for use in demanding settings.

Maximum Analog Input Voltage: 5.5 V

The high maximum analog input voltage of 5.5V allows for compatibility with a wide range of analog signal levels, ensuring versatility in measuring various voltage signals accurately.

Sample Rate: 0.04 MHz

The high sample rate of 0.04 MHz enables the ADC to capture and convert analog signals rapidly, making it suitable for applications requiring fast data acquisition and real-time signal processing.

Technology: CMOS

The CMOS technology used in the ADC provides low power consumption, high noise immunity, and fast operation, contributing to the overall efficiency and reliability of the device.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process and ensures secure connections on the PCB, enhancing the ease of assembly and reliability of the ADC in various applications.

Converter Type: ADC, SUCCESSIVE APPROXIMATION

The successive approximation ADC type offers high speed and accuracy in converting analog signals to digital, making it suitable for applications that require precise measurements and fast response times.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard power sources, simplifying the integration of the ADC into existing electronic systems and reducing the need for additional voltage regulation.

Output Bit Code: BINARY

The binary output bit code simplifies data processing and analysis after conversion, making it convenient to interface the ADC with digital systems and microcontrollers for further manipulation of the converted data.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy soldering and connection to the PCB, enhancing the ease of assembly and ensuring reliable electrical connections for consistent performance.

Minimum Analog Input Voltage: 0 V

The low minimum analog input voltage of 0V enables the ADC to accurately measure and convert even the smallest voltage signals, ensuring precise data acquisition across a wide range of input voltages.

Output Format: SERIAL

The serial output format simplifies data transmission and communication with external devices, making it convenient to interface the ADC with various digital systems and microcontrollers for seamless data exchange.

Sample and Hold/Track and Hold: SAMPLE

The sample-and-hold feature allows the ADC to accurately capture and convert analog signals at a specific moment in time, ensuring precise measurements and reliable data acquisition in dynamic signal environments.

Technical Specifications

Analog-to-Digital Converters TLC542IFNG3 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Quad

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.353 in (8.965 mm)

Length:

0.353 in (8.965 mm)

Maximum Seated Height:

0.18 in (4.57 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Chip Carrier

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

Standards and Codes

JESD-30 Code:

S-PQCC-J20

Qualified:

No

JESD-609 Code:

e3

Trade Compliance

TLC542IFNG3 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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