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TLC542CDWRG4

Texas Instruments

TLC542CDWRG4 by Texas Instruments

TLC542CDWRG4 by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 5V power supply. It is used for commercial applications requiring a sample rate of 0.04 MHz, with a conversion time of 20us. The converter type is successive approximation, featuring a serial output format and small outline package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 7,240 parts In-Stock

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Vyrian

USA . 5,286 parts In-Stock

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Digiode

USA . 2,202 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 197 parts In-Stock

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$6.928

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197

$6.928

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One Stop Electronics

USA . 1,254 parts In-Stock

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$8.000

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$8.000

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Parana Technologies

USA . 412 parts In-Stock

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$10.660

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$11.151

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412

$10.660

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$11.151

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DigiPath Technology Company

USA . 122 parts In-Stock

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$11.738

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$10.799

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122

$11.738

$10.799

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ChromeModa Solutions

Germany . 6,728 parts In-Stock

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$11.978

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$9.822

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$11.978

$9.822

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IDEA Electronic Components Group

UK . 26 parts In-Stock

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$11.978

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$11.379

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$10.780

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26

$11.978

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$10.780

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Microchip USA

USA . 1,727 parts In-Stock

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Corphita

USA . 1,172 parts In-Stock

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Overview

Unlock a world of precision with the TLC542CDWRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality Analog-to-Digital Converters that are essential for a wide range of applications. Whether you're designing industrial equipment or consumer electronics, this product offers unmatched value and reliability. Experience the benefits of fast conversion times, high accuracy, and a compact design that will streamline your projects. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers good durability and protection for the internal components of the ADC.

No. of Analog In Channels: 11

Provides multiple input channels for versatile input signal processing.

No. of Bits: 8

Offers a reasonable resolution for converting analog signals to digital.

Maximum Linearity Error (EL): 0.1953 %

Ensures accurate conversion of analog signals without significant errors.

Maximum Operating Temperature: 70 °C

Can operate effectively in a wide range of temperature environments.

Technology: CMOS

Utilizes CMOS technology for efficient and low-power analog-to-digital conversion.

Output Format: SERIAL

Outputs data in serial format for easy integration with other digital systems.

Technical Specifications

Analog-to-Digital Converters TLC542CDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

20 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

0 °C (32 °F)

Maximum Operating Temperature:

70 °C (158 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC542CDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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