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TLC541IDWRG4

Texas Instruments

TLC541IDWRG4 by Texas Instruments

TLC541IDWRG4 by Texas Instruments is an 8-bit ADC with 11 analog in channels, 0.1953% max linearity error, and 5V power supply. Ideal for industrial applications, it offers a sample rate of 0.04 MHz and operates b/w -40 to 85°C. With a compact design and serial output format, it suits various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,088 parts In-Stock

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Digiode

USA . 187 parts In-Stock

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187

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Distributors (Availability)

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One Stop Electronics

USA . 983 parts In-Stock

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$1.000

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983

$1.000

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Parana Technologies

USA . 1,200 parts In-Stock

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$14.291

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$14.740

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$14.291

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AZTECH Wire

Italy . 303 parts In-Stock

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$15.297

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303

$15.297

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DigiPath Technology Company

USA . 88 parts In-Stock

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$15.736

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$14.477

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88

$15.736

$14.477

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ChromeModa Solutions

Germany . 6,418 parts In-Stock

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$16.057

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$13.167

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6,418

$16.057

$13.167

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IDEA Electronic Components Group

UK . 20 parts In-Stock

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$16.057

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$15.254

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$14.451

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20

$16.057

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$14.451

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Component Stockers USA

USA . 704 parts In-Stock

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$99.990

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704

$99.990

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Microchip USA

USA . 2,389 parts In-Stock

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Corphita

USA . 2,187 parts In-Stock

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Overview

Unlock the power of precision with the TLC541IDWRG4 Analog-to-Digital Converter by Texas Instruments. This top-quality device boasts 8 bits of accuracy and 11 analog input channels, making it ideal for a wide range of applications in industrial settings. With a compact design and high efficiency, the TLC541IDWRG4 delivers unparalleled performance and reliability. Trust Texas Instruments to provide cutting-edge technology that meets your needs while exceeding your expectations. Elevate your projects with the TLC541IDWRG4 - the perfect choice for seamless conversion and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material for packaging, ensuring product longevity and affordability.

No. of Analog In Channels: 11

Provides a wide range of input channels, allowing for versatile and complex analog signal processing.

Surface Mount: YES

Easily mountable on circuit boards, simplifying the integration process in electronic systems.

No. of Bits: 8

Offers high resolution in conversion, providing detailed and accurate digital representations of analog inputs.

Maximum Linearity Error (EL): 0.1953 %

Ensures minimal deviation from ideal linear response, guaranteeing precision in analog-to-digital conversion.

Power Supplies (V): 5

Operates at a standard voltage, making it compatible with common power sources in electronic devices.

No. of Terminals: 20

Sufficient terminals for connecting external components, facilitating flexible and expandable system design.

Maximum Conversion Time: 17 us

Fast conversion time for rapid processing of analog signals, suitable for real-time applications.

Maximum Operating Temperature: 85 °C

Wide operating temperature range, ensuring reliability and performance in diverse environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding applications in varied temperature settings.

Technical Specifications

Analog-to-Digital Converters TLC541IDWRG4 attributes and parameters. Explore more Analog-to-Digital Converters devices from Texas Instruments

Converter Specifications

No. of Analog In Channels:

11

No. of Functions:

1

No. of Bits:

8

Sub-Category:

Analog to Digital Converters

Output Bit Code:

Binary

Output Format:

Serial

Maximum Linearity Error (EL):

0.1953 %

Sample Rate:

40 kHz

Hold Mode:

Sample

Maximum Conversion Time:

17 µs

Electrical Specifications

Power Supplies:

5 V

Minimum Analog Input Voltage:

0 mV

Maximum Analog Input Voltage:

5.5 V

Nominal Supply Voltage:

5 V

Operating Conditions

Moisture Sensitivity Level (MSL):

1

Minimum Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Temperature Grade:

Peak Reflow Temperature:

260 °C (500 °F)

Maximum Time At Peak Reflow Temperature:

30 s

Form Factor

Terminal Position:

Dual

No. of Terminals:

20

Terminal Form:

Terminal Pitch:

0.05 in (1.27 mm)

Surface Mount:

Yes

Width:

0.295 in (7.5 mm)

Length:

0.504 in (12.8 mm)

Maximum Seated Height:

0.104 in (2.65 mm)

Packaging

Package Body Material:

Plastic/Epoxy

Package Style:

Small Outline

Package Shape:

Package Equivalence Code:

SOP20,.4

Package Code:

SOP

Standards and Codes

JESD-30 Code:

R-PDSO-G20

Qualified:

No

JESD-609 Code:

e4

Trade Compliance

TLC541IDWRG4 Converters trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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