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TL16PNP100AFNR

Texas Instruments

TL16PNP100AFNR by Texas Instruments

TL16PNP100AFNR by Texas Instruments is a 44-terminal microprocessor circuit with CMOS technology. It operates b/w 0-70°C, with supply voltage of 4.75-5.25V. Ideal for applications requiring low power consumption and compact design in commercial-grade environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,495 parts In-Stock

1+ parts

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5,495

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Digiode

USA . 1,584 parts In-Stock

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1,584

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,140 parts In-Stock

1+ parts

$7.000

100+ parts

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1,140

$7.000

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AZTECH Wire

Italy . 326 parts In-Stock

1+ parts

$13.618

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326

$13.618

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Corohmni

South Africa . 5,004 parts In-Stock

1+ parts

$66.616

100+ parts

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5,004

$66.616

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Parana Technologies

USA . 672 parts In-Stock

1+ parts

$70.865

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672

$70.865

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DigiPath Technology Company

USA . 1,420 parts In-Stock

1+ parts

$78.032

100+ parts

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1,420

$78.032

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ChromeModa Solutions

Germany . 4,131 parts In-Stock

1+ parts

$79.624

100+ parts

$65.292

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4,131

$79.624

$65.292

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IDEA Electronic Components Group

UK . 2,356 parts In-Stock

1+ parts

$79.624

100+ parts

$75.643

1k+ parts

$71.662

10k+ parts

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2,356

$79.624

$75.643

$71.662

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Corphita

USA . 3,434 parts In-Stock

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3,434

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Overview

Enhance your electronic projects with the TL16PNP100AFNR by Texas Instruments, a top-tier manufacturer known for quality and innovation. This versatile microprocessor circuit offers a wide range of applications in various industries, providing unmatched performance and reliability. With a commercial-grade temperature grade and low power consumption, this chip carrier package is designed to exceed your expectations. Experience the seamless integration and superior functionality that Texas Instruments brings to the table with the TL16PNP100AFNR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the integrated circuits, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easier and more efficient assembly onto circuit boards, saving time during manufacturing.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage provides flexibility in power input options, making it suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for more efficient use of space on the circuit board, maximizing component density.

Power Supplies (V): 5

Standard power supply voltage of 5V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 44

44 terminals provide sufficient connections for interfacing with other components and peripherals in a complex system.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers improved thermal performance and allows for easier heat dissipation during operation.

Minimum Supply Voltage: 4.75 V

Having a lower minimum supply voltage ensures stability of operation even under varying power input conditions.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows for reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in a wide range of temperature environments, from freezing cold to tropical heat.

Terminal Position: QUAD

Quad terminal position provides multiple connection points for enhanced stability and reliability in data transmission.

Maximum Seated Height: 4.57 mm

Low maximum seated height allows for compact design and easy integration into space-constrained applications.

Width: 16.585 mm

Narrow width makes it suitable for applications where space-saving and compact design is a priority.

Length: 16.585 mm

Compact length ensures a smaller footprint on the circuit board, optimizing layout design for efficient space utilization.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates suitability for standard commercial applications, offering reliable performance in typical operating conditions.

Peripheral IC Type: MICROPROCESSOR CIRCUIT

Microprocessor circuit provides high processing capability, making it ideal for handling complex operations and calculations efficiently.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring energy efficiency and reliable performance in noisy environments.

Terminal Form: J BEND

J bend terminal form allows for easy soldering and secure connection with the circuit board, enhancing reliability and durability of the product.

Maximum Supply Current: 0.7 mA

Low maximum supply current consumption helps in saving power and reducing heat dissipation, making it an energy-efficient choice.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage of 5V ensures compatibility with common power sources and simplifies integration into existing systems.

Terminal Pitch: 1.27 mm

Optimal terminal pitch of 1.27mm facilitates easy connections and reduces the risk of short circuits, improving overall reliability and ease of use.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TL16PNP100AFNR attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J44

Length:

16.585 mm

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Bus Controllers

Maximum Supply Current:

.7 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

16.585 mm

Peripheral IC Type:

Trade Compliance

TL16PNP100AFNR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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