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TL16PNP550FN

Texas Instruments

TL16PNP550FN by Texas Instruments

TL16PNP550FN by Texas Instruments is a 68-terminal CMOS chip carrier with 5V supply voltage. It operates b/w 0-70°C, suitable for commercial applications. This surface-mount IC is ideal for various functions in microprocessors and peripheral devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,940 parts In-Stock

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1,940

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Digiode

USA . 1,123 parts In-Stock

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1,123

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Distributors (Availability)

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AZTECH Wire

Italy . 683 parts In-Stock

1+ parts

$6.678

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683

$6.678

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One Stop Electronics

USA . 1,321 parts In-Stock

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$35.000

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1,321

$35.000

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Parana Technologies

USA . 664 parts In-Stock

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$60.752

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664

$60.752

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ChromeModa Solutions

Germany . 5,536 parts In-Stock

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$68.261

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$55.974

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5,536

$68.261

$55.974

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IDEA Electronic Components Group

UK . 861 parts In-Stock

1+ parts

$68.261

100+ parts

$64.848

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$61.435

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861

$68.261

$64.848

$61.435

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Corohmni

South Africa . 97 parts In-Stock

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$76.737

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97

$76.737

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Corphita

USA . 3,421 parts In-Stock

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DigiPath Technology Company

USA . 76 parts In-Stock

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$61.544

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76

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Overview

Experience the innovation of Texas Instruments with the TL16PNP550FN, a cutting-edge IC designed for a wide range of applications. This high-quality product boasts reliable performance and durability, making it a standout choice in the industry. With its advanced technology and versatile design, this chip carrier offers immense value to customers seeking top-notch solutions for their projects. Trust Texas Instruments to deliver excellence in every aspect with the TL16PNP550FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time during assembly.

Package Shape: SQUARE

The square shape allows for a compact design, optimizing space on the circuit board.

Power Supplies (V): 5

Operates at a standard voltage level, making it compatible with various systems.

No. of Terminals: 68

Provides ample connectivity options for interfacing with other components in the circuit.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers a protective housing for the IC, safeguarding it from external elements.

Maximum Operating Temperature: 70 °C

Can withstand high operating temperatures, ensuring reliability in challenging environments.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature conditions, making it versatile for a range of applications.

Terminal Position: QUAD

The quad terminal position allows for secure and stable connections within the circuit.

Temperature Grade: COMMERCIAL

Designed for commercial use, ensuring consistent performance in standard operating conditions.

Technology: CMOS

Utilizes CMOS technology for efficient power consumption and high-speed operation.

Terminal Form: J BEND

The J bend terminal form provides a reliable and secure mounting option on the circuit board.

Nominal Supply Voltage: 5 V

Operates at a stable supply voltage of 5V, ensuring consistent performance in various applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and easy connections with other components on the circuit board.

Technical Specifications

Other Function uPs,uCs & Peripheral ICs TL16PNP550FN attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J68

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Microprocessor ICs

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

TL16PNP550FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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