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TL16C754BFNG4

Texas Instruments

TL16C754BFNG4 by Texas Instruments

TL16C754BFNG4 by Texas Instruments is a Serial Communication Controller with 3.3/5 V power supplies, 50 MHz clock frequency, and 0.375 MBps data transfer rate. Ideal for industrial applications requiring asynchronous communication protocols and low power mode operation. Package style is chip carrier with 68 terminals in a square shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,114 parts In-Stock

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Vyrian

USA . 2,451 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Resion

USA . 5 parts In-Stock

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One Stop Electronics

USA . 509 parts In-Stock

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$1.000

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509

$1.000

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AZTECH Wire

Italy . 358 parts In-Stock

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$4.913

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Ampacity Inc.

Singapore . 882 parts In-Stock

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$26.000

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$26.000

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Parana Technologies

USA . 2,221 parts In-Stock

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$69.181

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$6,424.467

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$62.263

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$62.263

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DigiPath Technology Company

USA . 641 parts In-Stock

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$76.176

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$76.176

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IDEA Electronic Components Group

UK . 1,970 parts In-Stock

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$77.731

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$73.844

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$69.958

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ChromeModa Solutions

Germany . 1,024 parts In-Stock

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$77.731

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$63.739

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QUARKTWIN TECHNOLOGY LTD

USA . 13,282 parts In-Stock

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Microchip USA

USA . 4,723 parts In-Stock

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Corphita

USA . 3,255 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Enhance your communication systems with the TL16C754BFNG4 from Texas Instruments, a leading manufacturer known for top-quality components. As a Serial Communication Controller, this chip offers seamless data transfer at a maximum rate of 0.375 MBps, making it ideal for various applications. With low power consumption and a wide operating temperature range, this versatile chip provides reliability and efficiency. Upgrade your projects today with the TL16C754BFNG4 and experience the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications without adding unnecessary weight.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving time and space during assembly.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage ensures compatibility with a variety of power sources, increasing versatility in design.

No. of Terminals: 68

With a high number of terminals, this product can facilitate complex communication requirements and connections within a system.

Maximum Data Transfer Rate: 0.375 MBps

A high data transfer rate enables fast and efficient communication, making this product suitable for applications requiring real-time data processing.

Minimum Operating Temperature: -40 °C

With a wide range of operating temperatures, this product can function reliably in harsh environmental conditions, enhancing its durability and usability.

Peripheral IC Type: SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

Being a specialized communication controller, this product is designed to efficiently manage serial data transmission, making it ideal for communication-intensive applications.

Technical Specifications

Serial Communication Controllers TL16C754BFNG4 attributes and parameters. Explore more Serial Communication Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

3

Boundary Scan:

NO

Maximum Clock Frequency:

50 MHz

Communication Protocol:

ASYNC, BIT

Data Encoding or Decoding Method:

NRZ

Maximum Data Transfer Rate:

.375 MBps

External Data Bus Width:

8

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e4

Length:

24.23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

8

No. of Serial I/Os:

4

No. of Terminals:

68

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Serial IO/Communication Controllers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.23 mm

Trade Compliance

TL16C754BFNG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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