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TIBPAL16L8-30MJB

Texas Instruments

TIBPAL16L8-30MJB by Texas Instruments

TIBPAL16L8-30MJB by Texas Instruments is a PAL-TYPE PLD with 30 ns propagation delay, 5.5 V max supply voltage, and 64 product terms. Ideal for MILITARY applications, it features 10 dedicated inputs, 6 I/O lines, and operates b/w -55 to 125 °C at a max clock frequency of 25 MHz.

Median Price

$71.197

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 26 parts In-Stock

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TME

Poland . 19 parts In-Stock

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Vyrian

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Digiode

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Sunrise Surplus Inc.

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Electronic Expediters

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Mil-Aero Solutions, Inc.

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ComSIT Distribution GmbH

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MISTER SPROCKETS

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Odi Ramu Company

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Manoshevitz Elec. Sales

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Holdelec - ElecDif-Pro

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North Shore Components

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AZTECH Wire

Italy . 632 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

USA . 767 parts In-Stock

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

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ChromeModa Solutions

Germany . 818 parts In-Stock

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Corphita

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Overview

Looking for top-notch Programmable Logic Devices? Look no further than the TIBPAL16L8-30MJB by Texas Instruments. With a reputation for quality and reliability, Texas Instruments delivers cutting-edge technology that is sure to exceed your expectations. This versatile PLD is perfect for a wide range of applications, offering fast propagation delay and a wide operating temperature range. Experience the value and benefits of this exceptional product today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides robust protection for the internal components, ensuring durability and reliability in various environments.

Propagation Delay: 30 ns

Fast propagation delay allows for quick processing and response times in logic operations.

Maximum Supply Voltage: 5.5 V

Supports a high supply voltage, providing flexibility in power requirements for different applications.

Screening Level: MIL-STD-883

Meets military screening standards, ensuring high reliability and quality in demanding operational conditions.

Technology Used: TTL

Utilizes TTL technology known for its high speed and low power consumption, making it suitable for efficient logic operations.

No. of Inputs: 16

Offers a sufficient number of inputs for versatile input configurations in logic design.

Package Shape: RECTANGULAR

Rectangular shape allows for compact and efficient PCB layout, optimizing space utilization.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during assembly.

Architecture: PAL-TYPE

PAL-type architecture offers programmable and versatile logic functions for customized logic designs.

Nominal Supply Voltage (V): 5

Nominal supply voltage of 5V matches common power requirements in many applications.

Packing Method: TUBE

Tube packaging ensures safe transportation and storage of the PLD device.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation of the device.

No. of Terminals: 20

Adequate number of terminals for versatile connectivity and integration in circuit designs.

Programmable IC Type: OT PLD

Programmable IC type offers flexibility for custom logic programming and reconfigurability.

Package Style (Meter): IN-LINE

In-line package style facilitates easy installation and connection in circuit layouts.

Output Function: COMBINATORIAL

Combinatorial output function enables complex logical operations and signal processing capabilities.

No. of Product Terms: 64

Large number of product terms for intricate logic functions and configurations.

Minimum Supply Voltage: 4.5 V

Supports a low minimum supply voltage, allowing for efficient power consumption in operation.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125°C for reliability in high-temperature environments.

Pitch Of Terminal: 2.54 mm

Standard pitch spacing for terminals facilitates easy integration and connection in PCB designs.

Organization: 10 DEDICATED INPUTS, 6 I/O

Organized layout with dedicated inputs and I/O lines for clear and efficient signal routing.

No. of Dedicated Inputs: 10

Dedicated inputs provide specific signal paths for optimized logic operations.

Minimum Operating Temperature: -55 °C

Operates reliably even in extremely low temperatures, making it suitable for a wide range of environments.

Finishing Of Terminal Used: Tin/Lead (Sn/Pb)

Tin/Lead terminal finishing enhances solderability and reliability of the connections.

Position Of Terminal: DUAL

Dual terminal position allows for secure and stable mounting on PCBs.

Maximum Seated Height: 5.08 mm

Low profile with maximum seated height of 5.08mm for compact integration in electronic systems.

Width: 7.62 mm

Narrow width of 7.62mm for space-efficient PCB layout and design.

Maximum Clock Frequency: 25 MHz

Supports clock frequencies up to 25MHz for high-speed data processing and logic operations.

No. of Outputs: 8

Multiple output lines provide flexibility in generating different logic signals and responses.

Length: 24.195 mm

Optimal length for easy integration and compact placement in circuit designs.

No. of I/O Lines: 6

Sufficient I/O lines for versatile connectivity and signal routing in logic operations.

Grading Of Temperature: MILITARY

Military-grade temperature grading ensures reliability and performance under harsh environmental conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-30MJB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16L8-30MJB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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