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TCM1539P-00

Texas Instruments

TCM1539P-00 by Texas Instruments

Texas Instruments TCM1539P-00 is a Telephone Ringer Circuit IC with 8 terminals in an inline package. Operating temperature range from -20°C to 70°C, suitable for commercial telecom applications. Package size of 7.62mm width and 5.08mm height, ideal for through-hole mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,980 parts In-Stock

1+ parts

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6,980

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Digiode

USA . 151 parts In-Stock

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151

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,084 parts In-Stock

1+ parts

$9.027

100+ parts

-

1k+ parts

$9.694

10k+ parts

-

2,084

$9.027

-

$9.694

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DigiPath Technology Company

USA . 1,183 parts In-Stock

1+ parts

$9.940

100+ parts

$9.145

1k+ parts

-

10k+ parts

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1,183

$9.940

$9.145

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ChromeModa Solutions

Germany . 2,615 parts In-Stock

1+ parts

$10.143

100+ parts

$8.317

1k+ parts

-

10k+ parts

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2,615

$10.143

$8.317

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IDEA Electronic Components Group

UK . 1,871 parts In-Stock

1+ parts

$10.143

100+ parts

$9.636

1k+ parts

$9.129

10k+ parts

-

1,871

$10.143

$9.636

$9.129

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AZTECH Wire

Italy . 546 parts In-Stock

1+ parts

$11.273

100+ parts

-

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546

$11.273

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One Stop Electronics

USA . 422 parts In-Stock

1+ parts

$92.000

100+ parts

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422

$92.000

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Corphita

USA . 3,299 parts In-Stock

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3,299

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Overview

Elevate your telephone line systems with the TCM1539P-00 by Texas Instruments. Crafted with quality and precision, this telephone ringer circuit offers unparalleled reliability and performance. Whether used in telecommunications, security systems, or industrial applications, this innovative IC delivers seamless connectivity and functionality. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations. Upgrade your projects today with the TCM1539P-00 and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and helps in reducing the overall weight of the product.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement within electronic circuitry.

No. of Terminals: 8

Having 8 terminals allows for multiple connections and flexibility in circuit design.

Package Style: IN-LINE

In-line package style is convenient for space-saving and easy installation on a circuit board.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature allows for operation in cold environments without any issues.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures stable connections.

Maximum Seated Height: 5.08 mm

Low seated height allows for compact design and easy integration in tight spaces.

Width: 7.62 mm

Compact width enables easy placement and routing on a circuit board.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures suitability for typical operating environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy soldering and secure connections on a PCB.

Telecom IC Type: TELEPHONE RINGER CIRCUIT

Specifically designed for telephone ringer circuits, ensuring optimized performance and functionality.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with various PCB designs and components.

Technical Specifications

Telephone Line ICs TCM1539P-00 attributes and parameters. Explore more Telephone Line ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T8

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

TCM1539P-00 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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