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SNJ54BCT541FK

Texas Instruments

SNJ54BCT541FK by Texas Instruments

SNJ54BCT541FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 8.7 ns at 5V, suitable for military-grade applications. It features a max I (ol) of 48A, operates in temperatures ranging from -55 to 125°C, and has a package style of CHIP CARRIER.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,705 parts In-Stock

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Vyrian

USA . 2,488 parts In-Stock

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2,488

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Distributors (Availability)

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Andel Nordic

Denmark . 3,225 parts In-Stock

1+ parts

$3.296

100+ parts

-

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$3.164

10k+ parts

$3.164

3,225

$3.296

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$3.164

$3.164

AZTECH Wire

Italy . 542 parts In-Stock

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$7.945

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542

$7.945

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One Stop Electronics

USA . 1,208 parts In-Stock

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$9.000

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$9.000

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Parana Technologies

USA . 1,286 parts In-Stock

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$28.973

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$53.848

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1,286

$28.973

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$53.848

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DigiPath Technology Company

USA . 1,922 parts In-Stock

1+ parts

$31.903

100+ parts

$29.351

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1,922

$31.903

$29.351

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ChromeModa Solutions

Germany . 2,670 parts In-Stock

1+ parts

$32.554

100+ parts

$26.694

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2,670

$32.554

$26.694

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IDEA Electronic Components Group

UK . 2,096 parts In-Stock

1+ parts

$32.554

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$30.926

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$29.299

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2,096

$32.554

$30.926

$29.299

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Microchip USA

USA . 4,579 parts In-Stock

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Corphita

USA . 3,140 parts In-Stock

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Perfect Parts

USA . 25 parts In-Stock

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Overview

Enhance your electronic designs with the SNJ54BCT541FK by Texas Instruments, a top-tier manufacturer known for quality and innovation. This bus driver and transceiver offers unparalleled reliability and performance, making it ideal for a wide range of applications. With fast propagation delay and true output polarity, this 8-bit device provides seamless communication in military-grade environments. Experience the value of Texas Instruments technology and elevate your projects to new heights with the SNJ54BCT541FK.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides durability and reliability, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 8.7 ns

Fast propagation delay ensures quick signal transmission, making the product efficient.

Surface Mount: YES

Enables easy and secure installation on circuit boards, saving time and effort during assembly.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB, maximizing component density.

No. of Bits: 8

8 bits allow for versatile data processing capabilities, making the product suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with common power sources.

No. of Terminals: 20

Provides multiple connection points for interfacing with other components, enhancing flexibility in system design.

Output Characteristics: 3-STATE

3-state output allows for high impedance state, enabling efficient sharing of bus lines among multiple devices.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable operation in extreme temperature conditions, ideal for rugged applications.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT541FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DUAL OUTPUT ENABLE

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

72 mA

Propagation Delay At Nominal Supply:

8.7 ns

Propagation Delay (tpd):

8.7 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Width:

8.89 mm

Trade Compliance

SNJ54BCT541FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-438-7112, 5962014387112

NIIN

014387112

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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