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SNJ54BCT373FK

Texas Instruments

SNJ54BCT373FK by Texas Instruments

SNJ54BCT373FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 9.5 ns at 5V, suitable for military-grade applications. It features a 3-STATE output and operates in a temperature range from -55 to 125°C, making it ideal for high-reliability systems requiring fast signal transmission. The chip carrier package with ceramic and metal-sealed co-fired materials ensures robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,040 parts In-Stock

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Digiode

USA . 1,623 parts In-Stock

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Electronics Depot

USA . 239 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 117 parts In-Stock

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Resion

USA . 43 parts In-Stock

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Distributors (Availability)

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Andel Nordic

Denmark . 2,671 parts In-Stock

1+ parts

$6.659

100+ parts

-

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$6.393

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$6.393

2,671

$6.659

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$6.393

$6.393

AZTECH Wire

Italy . 293 parts In-Stock

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$8.976

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$8.976

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One Stop Electronics

USA . 1,550 parts In-Stock

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$10.000

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Parana Technologies

USA . 406 parts In-Stock

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$22.594

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$2,098.236

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$20.335

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406

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DigiPath Technology Company

USA . 354 parts In-Stock

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$24.879

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354

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ChromeModa Solutions

Germany . 3,995 parts In-Stock

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$25.387

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$20.817

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$25.387

$20.817

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IDEA Electronic Components Group

UK . 259 parts In-Stock

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$25.387

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$24.118

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$22.848

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259

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$29.117

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$26.496

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$23.876

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Corphita

USA . 3,988 parts In-Stock

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Microchip USA

USA . 1,995 parts In-Stock

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Kepictronics

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Speed Components Ltd (Excess)

Israel . 30 parts In-Stock

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Overview

Elevate your circuit designs with the SNJ54BCT373FK by Texas Instruments. This top-tier Bus Driver & Transceiver offers unparalleled quality and reliability, thanks to its manufacturer's reputation for excellence. Whether you're working on industrial automation, telecommunications, or automotive applications, this product delivers exceptional performance and precision. Say goodbye to delays and disruptions, as this chip ensures fast propagation and seamless data transmission. Trust Texas Instruments to provide cutting-edge technology that brings value and advantages to your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides high reliability and robustness, making the product suitable for harsh environments and long-term use.

Propagation Delay At Nominal Supply: 9.5 ns

Low propagation delay ensures fast signal transmission, which is crucial for high-speed data communication in bus driver applications.

Surface Mount: YES

Ease of surface mounting makes installation and integration of the product convenient and efficient.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and easy placement on the board.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage compatibility ensures compatibility with a wide range of systems and applications.

Output Characteristics: 3-STATE

3-state output allows for tristate control, enabling the bus driver to actively drive signals, pull them high, or place them in a high impedance state.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, providing high speed and low power consumption for efficient bus driver operation.

Temperature Grade: MILITARY

Military-grade temperature range ensures reliable operation in extreme temperatures, making the product suitable for military and aerospace applications.

Technical Specifications

Bus Driver & Transceivers SNJ54BCT373FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW/HIGH

Count Direction:

UNIDIRECTIONAL

Family:

BCT/FBT

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

48 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay At Nominal Supply:

9.5 ns

Propagation Delay (tpd):

10.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Width:

8.89 mm

Trade Compliance

SNJ54BCT373FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-436-0311, 5962014360311

NIIN

014360311

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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