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SNJ54AC245FK

Texas Instruments

SNJ54AC245FK by Texas Instruments

SNJ54AC245FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 11.5 ns at 3.3V, suitable for military-grade applications. It features a max operating temperature of 125°C, output polarity TRUE, and supports common control with a max supply voltage of 6V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,747 parts In-Stock

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Digiode

USA . 1,968 parts In-Stock

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Electronics Depot

USA . 39 parts In-Stock

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Andel Nordic

Denmark . 24 parts In-Stock

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$4.602

100+ parts

-

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$4.418

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$4.418

24

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$4.418

One Stop Electronics

USA . 576 parts In-Stock

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$15.000

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AZTECH Wire

Italy . 258 parts In-Stock

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$17.783

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Parana Technologies

USA . 107 parts In-Stock

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$26.420

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$27.007

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$27.007

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DigiPath Technology Company

USA . 1,566 parts In-Stock

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$29.091

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ChromeModa Solutions

Germany . 348 parts In-Stock

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$29.685

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$24.342

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IDEA Electronic Components Group

UK . 38 parts In-Stock

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$29.685

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$28.201

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$26.716

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Corphita

USA . 4,755 parts In-Stock

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Microchip USA

USA . 3,889 parts In-Stock

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Overview

Enhance the performance of your electronic designs with the SNJ54AC245FK from Texas Instruments, a leading manufacturer known for its high-quality components. This bus driver & transceiver offers reliable signal transmission and versatility in various applications. With a MILITARY-grade screening level and a wide supply voltage range, this chip carrier package ensures superior functionality in extreme conditions. Say goodbye to compatibility issues and delays - choose Texas Instruments for unmatched value and seamless integration in your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability in harsh operating environments.

Propagation Delay At Nominal Supply: 11.5 ns

With a fast propagation delay, this bus driver & transceiver ensures quick signal transmission, reducing latency in communication systems.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Screening Level: MIL-PRF-38535

The MIL-PRF-38535 screening level ensures high quality and performance standards, making this product suitable for military and aerospace applications.

No. of Bits: 8

With 8 bits, this bus driver & transceiver can handle a wide range of data signals, making it versatile for various communication protocols.

Technical Specifications

Bus Driver & Transceivers SNJ54AC245FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AC

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

Length:

8.89 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

11.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

N/A

Width:

8.89 mm

Trade Compliance

SNJ54AC245FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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