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SNJ54ABT8543FK

Texas Instruments

SNJ54ABT8543FK by Texas Instruments

SNJ54ABT8543FK by Texas Instruments is an 8-bit bus driver with a propagation delay of 5.8 ns and operates at a nominal voltage of 5V. It features a MILITARY-grade temperature range, BICMOS technology, and is suitable for applications requiring independent control in military or high-reliability environments.

Median Price

$141.262

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,123 parts In-Stock

1+ parts

$141.262

100+ parts

$137.013

1k+ parts

$106.212

10k+ parts

-

1,123

$141.262

$137.013

$106.212

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 9 parts In-Stock

1+ parts

$26.033

100+ parts

$27.335

1k+ parts

$25.773

10k+ parts

-

9

$26.033

$27.335

$25.773

-

Bristol Electronics

USA . 14 parts In-Stock

1+ parts

$96.000

100+ parts

-

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-

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14

$96.000

-

-

-

Digiode

USA . 124 parts In-Stock

1+ parts

$134.199

100+ parts

-

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124

$134.199

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-

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Vyrian

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

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8,000

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-

-

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Inland Empire Components Inc.

USA . 25 parts In-Stock

1+ parts

-

100+ parts

-

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25

-

-

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Electronics Depot

USA . 15 parts In-Stock

1+ parts

-

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-

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15

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Microfarads

USA . 14 parts In-Stock

1+ parts

-

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-

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14

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,418 parts In-Stock

1+ parts

$7.070

100+ parts

-

1k+ parts

$6.787

10k+ parts

$6.787

4,418

$7.070

-

$6.787

$6.787

AZTECH Wire

Italy . 745 parts In-Stock

1+ parts

$13.270

100+ parts

-

1k+ parts

-

10k+ parts

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745

$13.270

-

-

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Parana Technologies

USA . 1,117 parts In-Stock

1+ parts

$20.552

100+ parts

-

1k+ parts

$20.635

10k+ parts

-

1,117

$20.552

-

$20.635

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DigiPath Technology Company

USA . 1,679 parts In-Stock

1+ parts

$22.630

100+ parts

$20.820

1k+ parts

-

10k+ parts

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1,679

$22.630

$20.820

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ChromeModa Solutions

Germany . 3,333 parts In-Stock

1+ parts

$23.092

100+ parts

$18.935

1k+ parts

-

10k+ parts

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3,333

$23.092

$18.935

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IDEA Electronic Components Group

UK . 469 parts In-Stock

1+ parts

$23.092

100+ parts

$21.937

1k+ parts

$20.783

10k+ parts

-

469

$23.092

$21.937

$20.783

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Corphita

USA . 3,105 parts In-Stock

1+ parts

$127.136

100+ parts

-

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3,105

$127.136

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-

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Microchip USA

USA . 1,947 parts In-Stock

1+ parts

-

100+ parts

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1,947

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Overview

Enhance your electronic circuits with the SNJ54ABT8543FK by Texas Instruments, a top-tier manufacturer known for its cutting-edge technology and reliable products. This high-performance Bus Driver & Transceiver offers lightning-fast speed and precision, making it perfect for a wide range of applications. From automotive systems to industrial automation, this versatile component provides unmatched value and efficiency to customers looking for quality solutions. Upgrade your projects with Texas Instruments and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired material ensures durability and reliability of the product, making it suitable for harsh operating environments.

Propagation Delay At Nominal Supply: 5.8 ns

With a low propagation delay, this bus driver & transceiver allows for fast signal transmission, improving overall system performance.

Package Shape: SQUARE

The square package shape provides ease of mounting and space efficiency in electronic circuit designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage, this product is compatible with most electronic systems and power sources.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this bus driver & transceiver can function reliably in extreme cold conditions.

Technology: BICMOS

The use of BiCMOS technology combines the advantages of bipolar and CMOS technologies, providing high-speed operation and low power consumption.

Maximum Power Supply Current (ICC): 38 mA

With a low power supply current requirement, this product is energy-efficient and helps in reducing overall power consumption in electronic systems.

Technical Specifications

Bus Driver & Transceivers SNJ54ABT8543FK attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

ABT

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e0

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Maximum I (ol):

64 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

38 mA

Propagation Delay At Nominal Supply:

5.8 ns

Propagation Delay (tpd):

7.3 ns

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535

Maximum Seated Height:

2.03 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Translation:

N/A

Width:

11.43 mm

Trade Compliance

SNJ54ABT8543FK Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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