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SN74LVU04APWTE4

Texas Instruments

SN74LVU04APWTE4 by Texas Instruments

SN74LVU04APWTE4 by Texas Instruments is a CMOS logic gate with 6 functions, 13 ns propagation delay at 2.5V, and 50 pF load capacitance. It is used in industrial applications for signal processing due to its small outline package and low power consumption of 0.02 mA at a max supply voltage of 5.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 9,920 parts In-Stock

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Vyrian

USA . 5,451 parts In-Stock

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Digiode

USA . 481 parts In-Stock

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481

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Nova Conductors

Japan . 50 parts In-Stock

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50

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AZTECH Wire

Italy . 791 parts In-Stock

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$16.017

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791

$16.017

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Ampacity Inc.

Singapore . 174 parts In-Stock

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$27.000

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Parana Technologies

USA . 2,346 parts In-Stock

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$28.885

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$52.929

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DigiPath Technology Company

USA . 595 parts In-Stock

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$31.806

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$29.261

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ChromeModa Solutions

Germany . 3,623 parts In-Stock

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$32.455

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$26.613

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IDEA Electronic Components Group

UK . 1,642 parts In-Stock

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$29.210

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One Stop Electronics

USA . 1,060 parts In-Stock

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Corphita

USA . 1,712 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Overview

Unlock the power of advanced technology with the SN74LVU04APWTE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability in logic gates. Perfect for applications requiring precision and efficiency, this product offers customers unparalleled value with its fast propagation delay, low power consumption, and superior performance. Trust Texas Instruments to provide you with the tools you need to succeed in your projects. Choose the SN74LVU04APWTE4 for unmatched quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the safety of the internal components, making this product a reliable choice.

Propagation Delay At Nominal Supply: 13 ns

The fast propagation delay ensures quick signal processing, making this product ideal for high-speed applications.

Surface Mount: YES

This feature allows for easy and efficient installation, making this product convenient to use in various electronic circuits.

No. of Functions: 6

With multiple functions in one package, this product offers versatility and saves space on the circuit board.

Nominal Supply Voltage / Vsup: 2.5 V

The low supply voltage requirement helps in reducing power consumption, making this product energy-efficient.

Load Capacitance (CL): 50 pF

This allows for efficient loading of signals, ensuring reliable operation in complex circuits.

Power Supplies (V): 3.3

Compatible with standard power supplies, this product can be easily integrated into existing systems.

No. of Terminals: 14

With a higher number of terminals, this product offers more connectivity options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The compact and sleek design of the package saves space and enhances the overall aesthetics of the circuit.

Maximum I (ol): 12 Amp

With a high maximum output current, this product can drive multiple components simultaneously, making it versatile in different applications.

Propagation Delay (tpd): 16 ns

The low propagation delay ensures minimal signal distortion, making this product suitable for precision applications.

Maximum Operating Temperature: 85 °C

Capable of operating in high-temperature environments, this product offers reliability in harsh conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range makes this product suitable for both extreme hot and cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This high-quality terminal finish ensures superior conductivity and corrosion resistance, enhancing the product's lifespan.

Terminal Position: DUAL

Dual terminal positions provide flexibility in circuit design, allowing for various connection configurations.

Maximum Seated Height: 1.2 mm

The low seated height of the package ensures compatibility with compact designs, making this product versatile in space-constrained applications.

Width: 4.4 mm

The compact width of the package saves space on the circuit board, making it suitable for small electronic devices.

Minimum Supply Voltage (Vsup): 2 V

The low minimum supply voltage requirement enables operation in low-power scenarios, making this product energy-efficient.

Peak Reflow Temperature °C: 260

Capable of withstanding high temperatures during the reflow process, this product offers robust soldering reliability.

Length: 5 mm

The compact length of the package saves space and allows for dense packing in electronic circuits.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the stringent requirements of harsh environments.

Technology: CMOS

The CMOS technology used in this product offers low power consumption and high noise immunity, making it suitable for battery-operated devices.

Terminal Form: GULL WING

The gull wing terminal form provides easy soldering and ensures mechanical stability, making this product reliable in operation.

Packing Method: TR

The tape and reel packing method allows for easy handling and integration into automated assembly processes, making this product convenient for mass production.

Terminal Pitch: 0.65 mm

The small terminal pitch enables high-density mounting, making this product suitable for compact electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

With a high maximum supply voltage tolerance, this product offers compatibility with a wide range of power sources.

Maximum Power Supply Current (ICC): 0.02 mA

The low power supply current requirement reduces energy consumption, making this product suitable for battery-operated devices.

Technical Specifications

Logic Gates SN74LVU04APWTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LV/LV-A/LVX/H

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.02 mA

Propagation Delay At Nominal Supply:

13 ns

Propagation Delay (tpd):

16 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN74LVU04APWTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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