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SN74LVC841APWT

Texas Instruments

SN74LVC841APWT by Texas Instruments

SN74LVC841APWT by Texas Instruments is a 10-bit bus driver with 6.7 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 1.8V and has a max operating temperature of 85°C. With surface mount capability and dual terminal position, it offers reliable performance in various electronic systems.

Median Price

$1.480

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,500 parts In-Stock

1+ parts

$1.480

100+ parts

$1.450

1k+ parts

$1.420

10k+ parts

-

5,500

$1.480

$1.450

$1.420

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,245 parts In-Stock

1+ parts

$1.406

100+ parts

-

1k+ parts

-

10k+ parts

-

2,245

$1.406

-

-

-

Vyrian

USA . 3,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,187

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,561 parts In-Stock

1+ parts

$1.332

100+ parts

-

1k+ parts

-

10k+ parts

-

1,561

$1.332

-

-

-

Andel Nordic

Denmark . 2,226 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

$2.218

10k+ parts

$2.218

2,226

$2.310

-

$2.218

$2.218

Parana Technologies

USA . 205 parts In-Stock

1+ parts

$8.775

100+ parts

$814.929

1k+ parts

$7.898

10k+ parts

-

205

$8.775

$814.929

$7.898

-

DigiPath Technology Company

USA . 1,087 parts In-Stock

1+ parts

$9.663

100+ parts

-

1k+ parts

-

10k+ parts

-

1,087

$9.663

-

-

-

ChromeModa Solutions

Germany . 3,546 parts In-Stock

1+ parts

$9.860

100+ parts

$8.085

1k+ parts

-

10k+ parts

-

3,546

$9.860

$8.085

-

-

IDEA Electronic Components Group

UK . 1,185 parts In-Stock

1+ parts

$9.860

100+ parts

$9.367

1k+ parts

$8.874

10k+ parts

-

1,185

$9.860

$9.367

$8.874

-

AZTECH Wire

Italy . 1,036 parts In-Stock

1+ parts

$16.820

100+ parts

-

1k+ parts

-

10k+ parts

-

1,036

$16.820

-

-

-

Microchip USA

USA . 937 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

937

-

-

-

-

Overview

Elevate your electronic designs with the SN74LVC841APWT by Texas Instruments, a top-tier manufacturer known for cutting-edge technology and reliability. As part of the Bus Driver & Transceivers category, this product offers high-quality performance and precision in signal transmission. With a fast propagation delay and 3-STATE output characteristics, it ensures seamless communication in various applications. Trust in Texas Instruments to provide superior products like the SN74LVC841APWT, delivering value, efficiency, and innovation to meet your design needs effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Propagation Delay At Nominal Supply: 6.7 ns

Low propagation delay ensures fast signal transmission, making the product efficient for high-speed data communication.

Surface Mount: YES

Surface mount capability allows for easy installation on PCBs, saving space and simplifying assembly processes.

Package Shape: RECTANGULAR

Rectangular shape provides a compact form factor, suitable for applications with limited space constraints.

No. of Bits: 10

10-bit design allows for more precise and detailed data processing, enhancing the product's performance.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and improving energy efficiency.

Power Supplies (V): 3.3

Supports power supplies of 3.3V, ensuring compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows the product to function reliably even in demanding industrial environments.

No. of Ports: 2

Dual ports provide flexibility and connectivity options, enabling the product to interface with multiple devices simultaneously.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various digital systems.

Technical Specifications

Bus Driver & Transceivers SN74LVC841APWT attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

7.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP24,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.7 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74LVC841APWT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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