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SN74LVC2G02DCUTE4

Texas Instruments

SN74LVC2G02DCUTE4 by Texas Instruments

SN74LVC2G02DCUTE4 by Texas Instruments is a logic gate with 2 functions and inputs, operating at 1.8V to 5.5V. It has a propagation delay of 4.9ns, output characteristics in 3-STATE, and can handle load capacitance of 50pF. Ideal for automotive applications due to its CMOS technology and wide temperature range from -40°C to 125°C.

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Overview

Unlock the power of cutting-edge technology with the SN74LVC2G02DCUTE4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality logic gates that provide reliable performance and precision. Perfect for a wide range of applications, this product offers fast propagation delay and low power consumption, making it ideal for automotive use. With its compact design and advanced features, the SN74LVC2G02DCUTE4 is the perfect solution for customers who demand nothing but the best in electronic components. Experience the difference with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Propagation Delay At Nominal Supply: 4.9 ns

With a low propagation delay, this logic gate ensures fast processing of signals, making it suitable for high-speed applications.

Surface Mount: YES

The surface-mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 2

This logic gate offers multiple functions in a single package, providing versatility and efficiency in circuit design.

No. of Inputs: 2

With two inputs, this logic gate can process multiple signals simultaneously, enhancing its overall performance.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, making it easy to fit into tight spaces on a circuit board.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage requirement of 1.8V helps in reducing power consumption and heat generation in the circuit.

Load Capacitance (CL): 50 pF

The low load capacitance of 50pF ensures efficient signal transmission, reducing the risk of signal distortion.

Power Supplies (V): 3.3

With a power supply of 3.3V, this logic gate is compatible with standard voltage levels in many electronic systems.

No. of Terminals: 8

The eight terminals provide ample connection points, allowing for easy integration into complex circuit designs.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

The small outline and thin profile of this package style save space on the circuit board, ideal for compact electronic devices.

Maximum I (ol): 24 Amp

With a high maximum output current of 24A, this logic gate can drive heavy loads without overheating, ensuring reliable performance.

Propagation Delay (tpd): 8.9 ns

The short propagation delay of 8.9ns ensures quick signal processing, vital for real-time applications where speed is crucial.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the reliable performance of this logic gate even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output characteristic provides an additional state, adding flexibility and functionality to the circuit design.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this logic gate to function effectively in cold environments without any performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures good conductivity and corrosion resistance, improving the longevity and reliability of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options, making it easier to integrate this logic gate into different circuit configurations.

Maximum Seated Height: 0.9 mm

With a maximum seated height of 0.9mm, this logic gate is slim and compact, suitable for applications with limited vertical space.

Width: 2 mm

The 2mm width of this logic gate makes it suitable for compact circuit board designs, saving valuable space in electronic devices.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V allows for operation in low-power applications, saving energy and reducing costs.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time of 30 seconds at peak reflow temperature ensures safe and reliable soldering during assembly, reducing the risk of damage to the product.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and bonding of the components, guaranteeing a secure connection in the circuit.

Length: 2.3 mm

The 2.3mm length of this logic gate makes it compact and space-efficient, suitable for applications with limited board space.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the reliability and durability of this logic gate in automotive applications, where temperature fluctuations are common.

Technology: CMOS

The CMOS technology used in this logic gate provides low power consumption and high noise immunity, making it suitable for battery-operated devices and noise-sensitive applications.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and mounting, ensuring a secure and reliable connection in the circuit.

Packing Method: TR

The tape and reel packing method provides convenient storage and handling, streamlining the production process and reducing assembly time.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm allows for precise and compact placement of this logic gate on the circuit board, optimizing space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V offers flexibility in power requirements, accommodating a wide range of voltage inputs for compatibility with various systems.

Technical Specifications

Logic Gates SN74LVC2G02DCUTE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

4.9 ns

Propagation Delay (tpd):

8.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN74LVC2G02DCUTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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