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SN74LVC1G374YEPR

Texas Instruments

SN74LVC1G374YEPR by Texas Instruments

SN74LVC1G374YEPR by Texas Instruments is a 3-STATE output bus driver with a propagation delay of 6 ns at 1.8V, suitable for industrial applications. It operates b/w -40 to 85°C, supports a max frequency of 150MHz, and has a load capacitance of 50pF. This surface-mount device features a very thin profile package style with grid array terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,086 parts In-Stock

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Digiode

USA . 1,230 parts In-Stock

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1,230

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Distributors (Availability)

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Andel Nordic

Denmark . 1,312 parts In-Stock

1+ parts

$4.083

100+ parts

-

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$3.920

10k+ parts

$3.920

1,312

$4.083

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$3.920

$3.920

AZTECH Wire

Italy . 747 parts In-Stock

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$11.679

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747

$11.679

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Parana Technologies

USA . 186 parts In-Stock

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$25.577

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$26.193

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186

$25.577

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$26.193

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DigiPath Technology Company

USA . 1,782 parts In-Stock

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$28.163

100+ parts

$25.910

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1,782

$28.163

$25.910

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ChromeModa Solutions

Germany . 4,715 parts In-Stock

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$28.738

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$23.565

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4,715

$28.738

$23.565

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IDEA Electronic Components Group

UK . 2,003 parts In-Stock

1+ parts

$28.738

100+ parts

$27.301

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$25.864

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2,003

$28.738

$27.301

$25.864

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One Stop Electronics

USA . 1,166 parts In-Stock

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$55.000

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Component Stockers USA

USA . 371 parts In-Stock

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$99.990

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371

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Corphita

USA . 2,643 parts In-Stock

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Microchip USA

USA . 339 parts In-Stock

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Overview

Unleash the power of seamless communication with the SN74LVC1G374YEPR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their Bus Driver & Transceivers category. This product offers lightning-fast propagation delay, compact surface mount design, and versatile 3-STATE output characteristics. Ideal for industrial applications, this device boasts a wide temperature range and low power consumption. Elevate your projects with the exceptional value and performance that only Texas Instruments can provide.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 6 ns

Low propagation delay ensures fast and efficient data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability enables easy and convenient installation on PCBs, saving space and allowing for automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.8

Low nominal supply voltage helps in reducing power consumption and heat dissipation, leading to energy-efficient operation.

Maximum I (ol): 24 Amp

High maximum output current capability allows for driving heavy loads, making this product suitable for demanding applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems, enhancing the overall performance of the product.

Technical Specifications

Bus Driver & Transceivers SN74LVC1G374YEPR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-XBGA-B6

Length:

1.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

24 Amp

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6 ns

Propagation Delay (tpd):

18.3 ns

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

.9 mm

Trade Compliance

SN74LVC1G374YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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