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SN74GTLPH3245ZKFR

Texas Instruments

SN74GTLPH3245ZKFR by Texas Instruments

SN74GTLPH3245ZKFR by Texas Instruments is a 4-function bus driver & transceiver with GTL/P & LVTTL translation, 8-bit data width, and 3.3V nominal voltage. It features a propagation delay of 8.4ns, operates b/w -40 to 85°C, and has a low profile grid array package style. Ideal for bidirectional applications requiring true output polarity control in industrial settings.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,267 parts In-Stock

1+ parts

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4,267

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Digiode

USA . 891 parts In-Stock

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891

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,466 parts In-Stock

1+ parts

$2.285

100+ parts

-

1k+ parts

$2.193

10k+ parts

$2.193

1,466

$2.285

-

$2.193

$2.193

One Stop Electronics

USA . 759 parts In-Stock

1+ parts

$3.000

100+ parts

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759

$3.000

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AZTECH Wire

Italy . 750 parts In-Stock

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$7.857

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750

$7.857

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Parana Technologies

USA . 1,632 parts In-Stock

1+ parts

$12.354

100+ parts

$1,147.265

1k+ parts

$11.119

10k+ parts

-

1,632

$12.354

$1,147.265

$11.119

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DigiPath Technology Company

USA . 993 parts In-Stock

1+ parts

$13.603

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993

$13.603

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ChromeModa Solutions

Germany . 2,079 parts In-Stock

1+ parts

$13.881

100+ parts

$11.382

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2,079

$13.881

$11.382

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IDEA Electronic Components Group

UK . 933 parts In-Stock

1+ parts

$13.881

100+ parts

$13.187

1k+ parts

$12.493

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933

$13.881

$13.187

$12.493

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Corphita

USA . 370 parts In-Stock

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370

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Microchip USA

USA . 338 parts In-Stock

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338

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Overview

Elevate your electronics with the SN74GTLPH3245ZKFR by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality bus drivers and transceivers that cater to a wide range of applications. With a focus on innovation and reliability, this product boasts a multitude of benefits for customers, from its high-performance output characteristics to its industrial-grade temperature grade. Say goodbye to subpar performance and hello to the exceptional value and advantages that the SN74GTLPH3245ZKFR brings to the table. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various applications without adding unnecessary weight.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 4

With multiple functions available in a single component, this product offers versatility and flexibility in designing and implementing different bus driver and transceiver systems.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a standard 3.3V supply voltage makes it compatible with a wide range of systems and ensures consistency in performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand elevated temperatures and harsh environments, increasing its reliability and longevity.

Technology: BICMOS

Utilizing BiCMOS technology combines the benefits of both BiPolar and CMOS technologies, offering high speed, low power consumption, and robustness in one package.

Technical Specifications

Bus Driver & Transceivers SN74GTLPH3245ZKFR attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PBGA-B114

JESD-609 Code:

e1

Length:

16 mm

Logic IC Type:

Maximum I (ol):

100 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

114

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA114,6X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay (tpd):

8.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

GTL/P & LVTTL

Width:

5.5 mm

Trade Compliance

SN74GTLPH3245ZKFR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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