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SN74F08DRG4

Texas Instruments

SN74F08DRG4 by Texas Instruments

SN74F08DRG4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It has a propagation delay of 6.6 ns at 5V, making it suitable for high-speed applications. With a small outline package style and surface mount capability, it is ideal for compact electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,213 parts In-Stock

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Digiode

USA . 3,564 parts In-Stock

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North Shore Components

USA . 2,290 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 748 parts In-Stock

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$9.159

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One Stop Electronics

USA . 1,563 parts In-Stock

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$10.000

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Parana Technologies

USA . 1,075 parts In-Stock

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$30.069

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$66.723

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DigiPath Technology Company

USA . 2,209 parts In-Stock

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$33.109

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$30.461

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$33.109

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ChromeModa Solutions

Germany . 4,189 parts In-Stock

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$33.785

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$27.704

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$33.785

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IDEA Electronic Components Group

UK . 335 parts In-Stock

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$33.785

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$32.096

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$30.406

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QUARKTWIN TECHNOLOGY LTD

USA . 19,521 parts In-Stock

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Microchip USA

USA . 3,757 parts In-Stock

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Corphita

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Overview

Elevate your projects with the SN74F08DRG4 Logic Gates by Texas Instruments, a top-tier manufacturer known for delivering high-quality components. Ideal for various applications, this product offers unmatched reliability and efficiency, boasting a fast propagation delay and low power consumption. With its compact design and user-friendly features, the SN74F08DRG4 is the perfect choice for professionals seeking superior performance in their electronic designs. Upgrade your projects today with this exceptional logic gate from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the logic gates, ensuring long-lasting performance.

Propagation Delay At Nominal Supply: 6.6 ns

Low propagation delay ensures fast signal processing, making these logic gates suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing assembly time.

No. of Functions: 4

Multiple functions in a single package offer versatility and flexibility in designing circuits.

No. of Inputs: 2

Two inputs provide basic logic operations, making these gates suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes integration with existing systems easier and more convenient.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures stable operation and compatibility with various input/output devices.

Power Supplies (V): 5

Consistent power supply voltage ensures reliable performance under normal operating conditions.

No. of Terminals: 14

Sufficient number of terminals for easy connection and compatibility with standard PCB layouts.

Maximum I (ol): 20 Amp

High output current capability allows for driving multiple loads without external buffering.

Maximum Operating Temperature: 70 °C

Wide operating temperature range enables use in various environmental conditions without performance degradation.

Minimum Operating Temperature: 0 °C

Ability to operate at low temperatures ensures reliability in cold environments.

Technical Specifications

Logic Gates SN74F08DRG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

20 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

12.9 mA

Propagation Delay At Nominal Supply:

6.6 ns

Propagation Delay (tpd):

6.6 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gate

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

SN74F08DRG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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