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SN74CB3Q3125PWRE4

Texas Instruments

SN74CB3Q3125PWRE4 by Texas Instruments

SN74CB3Q3125PWRE4 by Texas Instruments is a 4-bit bus driver & transceiver with a propagation delay of 0.2 ns. It operates at a nominal voltage of 2.5V and has a small outline, thin profile package style. This IC is commonly used in industrial applications requiring bidirectional control with low enable signal.

Median Price

$0.395

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 969 parts In-Stock

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$0.395

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Nova Conductors

Japan . 90 parts In-Stock

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$0.487

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90

$0.487

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Vyrian

USA . 6,983 parts In-Stock

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Digiode

USA . 3,295 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 690 parts In-Stock

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$0.336

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690

$0.336

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Netroflash

USA . 500 parts In-Stock

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$0.487

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$0.477

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$0.487

$0.477

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AZTECH Wire

Italy . 359 parts In-Stock

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$12.241

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359

$12.241

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Parana Technologies

USA . 1,613 parts In-Stock

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$15.507

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$15.882

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1,613

$15.507

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$15.882

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DigiPath Technology Company

USA . 1,893 parts In-Stock

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$17.076

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ChromeModa Solutions

Germany . 4,999 parts In-Stock

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$17.424

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$14.288

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$17.424

$14.288

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IDEA Electronic Components Group

UK . 1,258 parts In-Stock

1+ parts

$17.424

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$16.553

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$15.682

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1,258

$17.424

$16.553

$15.682

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Andel Nordic

Denmark . 4,221 parts In-Stock

1+ parts

$20.793

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$19.961

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$19.961

4,221

$20.793

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$19.961

$19.961

Microchip USA

USA . 2,784 parts In-Stock

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Corphita

USA . 908 parts In-Stock

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Overview

Experience the ultimate in quality and performance with the SN74CB3Q3125PWRE4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional products that exceed expectations. The SN74CB3Q3125PWRE4 falls into the category of Bus Driver & Transceivers, offering versatile applications for various industries. With its compact design and advanced technology, this product provides customers with unparalleled value and benefits. From its high-speed propagation delay to its 3-STATE output characteristics, the SN74CB3Q3125PWRE4 ensures seamless and efficient data transmission. Discover the advantages of Texas Instruments' solutions and unlock endless possibilities for your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components, making this product suitable for rugged environments.

Propagation Delay At Nominal Supply: 0.2 ns

With a low propagation delay of 0.2 ns, this product ensures fast and efficient signal transmission, reducing latency and improving overall performance.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation, making this product suitable for space-constrained applications and allowing for efficient use of PCB real estate.

No. of Functions: 4

With four functions in a single device, this product offers versatility and flexibility in managing bus communications, enhancing efficiency and reducing the need for multiple separate components.

Package Shape: RECTANGULAR

The rectangular package shape facilitates ease of mounting and integration into larger systems or circuits, making this product compatible with various design requirements.

No. of Bits: 1

Having a single bit allows for simplicity and ease of implementation, making this product ideal for applications where a basic on/off or high/low functionality is required.

Nominal Supply Voltage / Vsup (V): 2.5

With a nominal supply voltage of 2.5V, this product offers compatibility with a wide range of systems and power sources, making it highly versatile and adaptable to different configurations.

Power Supplies (V): 2.5/3.3

Supporting dual power supplies at 2.5V and 3.3V, this product provides flexibility and compatibility with various voltage requirements, making it suitable for integration into diverse systems.

No. of Terminals: 14

The 14 terminals allow for easy connectivity and interface with other components or devices, contributing to a straightforward and reliable integration process.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style offer space-saving advantages, enabling compact designs and efficient utilization of board space, making this product ideal for size-constrained applications.

Propagation Delay (tpd): 0.2 ns

With a low propagation delay of 0.2 ns, this product ensures fast and accurate signal transmission, minimizing signal degradation and improving overall system performance.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product exhibits excellent thermal tolerance, allowing it to be used in demanding conditions and high-temperature environments with reliable performance.

Output Characteristics: 3-STATE

The 3-STATE output characteristic allows for easy circuit interfacing and signal control, enhancing flexibility and facilitating efficient data management.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40°C, this product offers reliable operation even in extreme cold environments, making it suitable for various application scenarios.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures strong and reliable electrical connections, promoting signal integrity and long-term durability.

Terminal Position: DUAL

The dual terminal position enables straightforward and secure mounting, enhancing ease of installation and ensuring a stable connection between the product and the circuit.

No. of Ports: 2

With two ports, this product allows for simultaneous communication between multiple devices or systems, facilitating efficient data flow and enabling more complex bus configurations.

Maximum Seated Height: 1.2 mm

The maximum seated height of 1.2 mm provides a low-profile design, reducing the overall height of the product and ensuring compatibility with space-constrained applications.

Width: 4.4 mm

With a compact width of 4.4 mm, this product offers space-saving advantages, allowing for efficient utilization of PCB real estate and compatibility with narrow form factors.

Output Polarity: TRUE

The true output polarity ensures accurate and reliable signal transmission, reducing the risk of errors and improving system performance.

Minimum Supply Voltage (Vsup): 2.3 V

With a minimum supply voltage of 2.3V, this product accommodates lower voltage systems, offering compatibility with a wide range of power sources and enhancing versatility in system integration.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time at peak reflow temperature of 30 seconds, this product allows for efficient soldering processes, reducing production time and facilitating manufacturing scalability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliable joint formation, contributing to the product's overall durability and longevity.

Length: 5 mm

With a compact length of 5 mm, this product offers flexibility in design integration and compatibility with various form factors, enhancing its suitability for diverse applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in a wide temperature range, making this product suitable for industrial applications that require robust performance in harsh environments.

Technology: CMOS

The CMOS technology employed in this product allows for low power consumption, ensuring energy efficiency and prolonging battery life in portable devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure and reliable solder joints, facilitating ease of assembly and enhancing the product's reliability and durability.

Packing Method: TR

The tape and reel (TR) packing method simplifies the handling, storage, and transportation of this product, promoting efficient manufacturing processes and reducing component waste.

Terminal Pitch: 0.65 mm

The terminal pitch of 0.65 mm offers compatibility with standard PCB manufacturing processes and facilitates reliable soldering, ensuring a strong electrical connection.

Count Direction: BIDIRECTIONAL

Being bidirectional, this product allows for data transmission in both directions, enabling versatile bus communication and supporting multi-directional data flows.

Control Type: ENABLE LOW

The enable low control type simplifies the control mechanism of this product, promoting ease of use and enhancing its versatility in various applications.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, this product exhibits excellent resistance to moisture absorption, ensuring long-term reliability and preventing potential damage caused by moisture exposure.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product allows for compatibility with higher voltage systems, expanding its range of potential applications.

Maximum Power Supply Current (ICC): 4 mA

With a maximum power supply current of 4 mA, this product offers efficient power consumption, contributing to energy efficiency and enabling prolonged battery life in portable devices.

Technical Specifications

Bus Driver & Transceivers SN74CB3Q3125PWRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH 3.3V SUPPLY

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CB3Q/3VH/3C/2B

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Maximum Power Supply Current (ICC):

4 mA

Propagation Delay At Nominal Supply:

.2 ns

Propagation Delay (tpd):

.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

4.4 mm

Trade Compliance

SN74CB3Q3125PWRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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