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SN74AUC2G07DCKRE4

Texas Instruments

SN74AUC2G07DCKRE4 by Texas Instruments

SN74AUC2G07DCKRE4 by Texas Instruments is a logic gate with 3.1 ns propagation delay, suitable for industrial applications. It operates at a nominal voltage of 1.2V and has open-drain output characteristics. With a compact package style and dual terminal position, it offers high performance in a small form factor.

Median Price

$0.703

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,031 parts In-Stock

1+ parts

-

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4,031

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Vyrian

USA . 3,128 parts In-Stock

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3,128

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Bristol Electronics

USA . 2,660 parts In-Stock

1+ parts

-

100+ parts

$0.703

1k+ parts

$0.487

10k+ parts

-

2,660

-

$0.703

$0.487

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Microfarads

USA . 2,567 parts In-Stock

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2,567

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 138 parts In-Stock

1+ parts

$10.248

100+ parts

-

1k+ parts

$10.784

10k+ parts

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138

$10.248

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$10.784

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DigiPath Technology Company

USA . 1,966 parts In-Stock

1+ parts

$11.285

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1,966

$11.285

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ChromeModa Solutions

Germany . 3,700 parts In-Stock

1+ parts

$11.515

100+ parts

$9.442

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-

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3,700

$11.515

$9.442

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IDEA Electronic Components Group

UK . 232 parts In-Stock

1+ parts

$11.515

100+ parts

$10.939

1k+ parts

$10.364

10k+ parts

-

232

$11.515

$10.939

$10.364

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AZTECH Wire

Italy . 330 parts In-Stock

1+ parts

$14.573

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330

$14.573

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One Stop Electronics

USA . 1,294 parts In-Stock

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$41.000

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1,294

$41.000

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Corphita

USA . 4,662 parts In-Stock

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Microchip USA

USA . 1,378 parts In-Stock

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Overview

Upgrade your electronics with the SN74AUC2G07DCKRE4 by Texas Instruments, a high-quality logic gate that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications. With fast propagation delay and low power consumption, this logic gate provides value and efficiency to customers looking to enhance their projects. Trust Texas Instruments for cutting-edge technology that delivers exceptional results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material provides durability and protection to the internal components of the logic gates.

Propagation Delay At Nominal Supply: 3.1 ns

Low propagation delay ensures fast signal processing and efficient operation.

Surface Mount: YES

Surface mount capability allows for easy and convenient mounting on circuit boards.

No. of Functions: 2

Having 2 functions in one package provides versatility and efficiency in design and implementation.

Nominal Supply Voltage / Vsup (V): 1.2

Compatible with a standard supply voltage, making it easy to integrate into existing circuits.

Load Capacitance (CL): 15 pF

Suitable load capacitance ensures stable performance in different circuit configurations.

Power Supplies (V): 1.2/2.5

Supports multiple power supply options for flexibility in system design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the logic gates energy-efficient and reliable.

Maximum Operating Temperature: 85 °C

Wide operating temperature range allows for use in various environments and applications.

Technical Specifications

Logic Gates SN74AUC2G07DCKRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AUC

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

9 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/2.5

Maximum Power Supply Current (ICC):

.01 mA

Propagation Delay At Nominal Supply:

3.1 ns

Propagation Delay (tpd):

3.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUC2G07DCKRE4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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