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SN74AS804BDWG4

Texas Instruments

SN74AS804BDWG4 by Texas Instruments

SN74AS804BDWG4 by Texas Instruments is a TTL logic gate with 6 functions and 2 inputs. It has a propagation delay of 8 ns at a nominal voltage of 5V, making it ideal for high-speed applications. This small outline package with gull wing terminals is designed for surface mount assembly in commercial-grade temperature environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,501 parts In-Stock

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Digiode

USA . 1,186 parts In-Stock

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Euro-Tech

UK . 118 parts In-Stock

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AZTECH Wire

Italy . 342 parts In-Stock

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$9.816

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One Stop Electronics

USA . 1,502 parts In-Stock

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Parana Technologies

USA . 1,378 parts In-Stock

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DigiPath Technology Company

USA . 2,097 parts In-Stock

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ChromeModa Solutions

Germany . 1,561 parts In-Stock

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$19.749

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$16.194

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IDEA Electronic Components Group

UK . 1,052 parts In-Stock

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Microchip USA

USA . 11,569 parts In-Stock

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Corphita

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Overview

Unleash the power of innovative technology with the SN74AS804BDWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Logic Gates that provide unparalleled performance and reliability. Ideal for a wide range of applications, this product offers customers the value and benefits they need to stay ahead of the competition. Discover the advantages of Texas Instruments' Logic Gates and elevate your projects to new heights.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 4 ns

This low propagation delay ensures that the output of the logic gate responds quickly to changes in the input signals.

No. of Functions: 6

Having 6 functions in one package means that this logic gate can perform multiple operations, making it versatile and efficient in circuit design.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes it compatible with many other components and simplifies circuit design.

Maximum I (ol): 48 Amp

The high maximum output current allows this logic gate to drive larger loads, making it suitable for a wide range of applications.

Technology: TTL

TTL technology is known for its high speed and reliability, making this logic gate suitable for applications that require fast switching speeds.

Technical Specifications

Logic Gates SN74AS804BDWG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Additional Features:

IOH = 48MA @ VOH = 2V; IOL = 48MA @ VOL = 0.5V

Family:

AS

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Maximum I (ol):

48 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

27 mA

Propagation Delay At Nominal Supply:

4 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

2.65 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

SN74AS804BDWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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