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SN74ALVC3651-15PCB

Texas Instruments

SN74ALVC3651-15PCB by Texas Instruments

SN74ALVC3651-15PCB by Texas Instruments is a 2Kx36 FIFO memory IC with 15ns cycle time, operating at 3.3V. It features synchronous operation, parallel interface, and output enable function. This low-profile device in a square package is ideal for commercial applications requiring fast data storage and retrieval.

Median Price

$95.682

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 273 parts In-Stock

1+ parts

-

100+ parts

$85.050

1k+ parts

$76.100

10k+ parts

$71.620

273

-

$85.050

$76.100

$71.620

DigiKey

USA . 273 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

273

-

-

-

-

Verical

USA . 273 parts In-Stock

1+ parts

-

100+ parts

$106.313

1k+ parts

$95.125

10k+ parts

$89.525

273

-

$106.313

$95.125

$89.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 459 parts In-Stock

1+ parts

$89.775

100+ parts

-

1k+ parts

-

10k+ parts

-

459

$89.775

-

-

-

Vyrian

USA . 4,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,187

-

-

-

-

DigiKey Marketplace

USA . 795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

795

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,344 parts In-Stock

1+ parts

$3.520

100+ parts

$326.881

1k+ parts

$3.168

10k+ parts

-

2,344

$3.520

$326.881

$3.168

-

DigiPath Technology Company

USA . 1,674 parts In-Stock

1+ parts

$3.876

100+ parts

$3.566

1k+ parts

-

10k+ parts

-

1,674

$3.876

$3.566

-

-

IDEA Electronic Components Group

UK . 1,659 parts In-Stock

1+ parts

$3.955

100+ parts

-

1k+ parts

$3.560

10k+ parts

-

1,659

$3.955

-

$3.560

-

ChromeModa Solutions

Germany . 1,220 parts In-Stock

1+ parts

$3.955

100+ parts

$3.243

1k+ parts

-

10k+ parts

-

1,220

$3.955

$3.243

-

-

Ampacity Inc.

Singapore . 273 parts In-Stock

1+ parts

$80.330

100+ parts

-

1k+ parts

-

10k+ parts

-

273

$80.330

-

-

-

Corphita

USA . 3,128 parts In-Stock

1+ parts

$85.050

100+ parts

-

1k+ parts

-

10k+ parts

-

3,128

$85.050

-

-

-

Microchip USA

USA . 307 parts In-Stock

1+ parts

$158.230

100+ parts

$155.480

1k+ parts

$154.100

10k+ parts

$152.730

307

$158.230

$155.480

$154.100

$152.730

Overview

Enhance your electronic projects with the SN74ALVC3651-15PCB by Texas Instruments, a top-tier manufacturer known for its high-quality components. This FIFO device offers seamless data storage and retrieval, making it perfect for applications requiring fast and efficient data transfer. With a low cycle time of 15 ns and a wide operating temperature range, this product ensures reliable performance in various environments. Invest in the SN74ALVC3651-15PCB today and experience the unmatched value, benefits, and advantages it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the components inside, making the product robust and long-lasting.

Cycle Time: 15 ns

Fast cycle time of 15 nanoseconds ensures quick and efficient operation, making it suitable for high-speed applications.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures precise timing and coordination between data inputs and outputs, enhancing overall performance.

Memory IC Type: BI-DIRECTIONAL FIFO

Bi-directional FIFO design allows for simultaneous read and write operations, improving data flow efficiency and reducing bottlenecks.

Maximum Access Time: 9.5 ns

Low maximum access time of 9.5 nanoseconds ensures minimal delay in accessing data, enhancing real-time processing capabilities.

Technical Specifications

FIFO SN74ALVC3651-15PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

9.5 ns

Additional Features:

RETRANSMIT; MAILBOX

Cycle Time:

15 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

73728 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ALVC3651-15PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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