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SN74ALVC3641-20PCB

Texas Instruments

SN74ALVC3641-20PCB by Texas Instruments

SN74ALVC3641-20PCB by Texas Instruments is a 1Kx36 CMOS FIFO with 20ns cycle time and operates at 3.3V. It features parallel operation, GULL WING terminals, and low profile FLATPACK package style. Ideal for applications requiring fast data transfer in commercial temperature environments.

Median Price

$14.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 251 parts In-Stock

1+ parts

-

100+ parts

$14.270

1k+ parts

-

10k+ parts

-

251

-

$14.270

-

-

Rochester

USA . 236 parts In-Stock

1+ parts

-

100+ parts

$12.350

1k+ parts

$11.050

10k+ parts

$10.400

236

-

$12.350

$11.050

$10.400

Verical

USA . 236 parts In-Stock

1+ parts

-

100+ parts

$15.438

1k+ parts

$13.813

10k+ parts

$13.000

236

-

$15.438

$13.813

$13.000

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,511 parts In-Stock

1+ parts

$13.034

100+ parts

-

1k+ parts

-

10k+ parts

-

4,511

$13.034

-

-

-

Vyrian

USA . 6,225 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,225

-

-

-

-

DigiKey Marketplace

USA . 251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

251

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 171 parts In-Stock

1+ parts

$3.636

100+ parts

-

1k+ parts

$4.145

10k+ parts

-

171

$3.636

-

$4.145

-

DigiPath Technology Company

USA . 563 parts In-Stock

1+ parts

$4.003

100+ parts

-

1k+ parts

-

10k+ parts

-

563

$4.003

-

-

-

ChromeModa Solutions

Germany . 4,164 parts In-Stock

1+ parts

$4.085

100+ parts

$3.350

1k+ parts

-

10k+ parts

-

4,164

$4.085

$3.350

-

-

IDEA Electronic Components Group

UK . 134 parts In-Stock

1+ parts

$4.085

100+ parts

-

1k+ parts

$3.676

10k+ parts

-

134

$4.085

-

$3.676

-

Corphita

USA . 4,508 parts In-Stock

1+ parts

$12.348

100+ parts

-

1k+ parts

-

10k+ parts

-

4,508

$12.348

-

-

-

Component Stockers USA

USA . 658 parts In-Stock

1+ parts

$14.210

100+ parts

$13.370

1k+ parts

-

10k+ parts

-

658

$14.210

$13.370

-

-

Microchip USA

USA . 225 parts In-Stock

1+ parts

$39.960

100+ parts

$39.390

1k+ parts

$39.100

10k+ parts

$38.810

225

$39.960

$39.390

$39.100

$38.810

Overview

Experience seamless data transfer and efficient memory management with the SN74ALVC3641-20PCB by Texas Instruments. Crafted with precision and reliability in mind, this FIFO device offers a wide range of applications in various industries. From its high-quality construction to its innovative technology, this product provides unmatched value and benefits to customers looking for superior performance and functionality. Trust Texas Instruments to deliver cutting-edge solutions that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Surface Mount: YES

The surface mount feature allows for easy installation on printed circuit boards, saving space and enhancing usability.

Cycle Time: 20 ns

The fast cycle time of 20ns ensures quick data storage and retrieval, making the product efficient and reliable.

No. of Words: 1024 words

With a high number of words, this FIFO product offers ample storage capacity for data, making it suitable for demanding applications.

Maximum Operating Temperature: 70 °C

The ability to operate at a maximum temperature of 70°C ensures the product can withstand harsh environmental conditions, increasing its reliability.

Technology: CMOS

Being based on CMOS technology, the product consumes low power while offering high speed and reliable performance, making it a cost-effective choice.

Memory Density: 36864 bit

The high memory density of 36864 bit allows for efficient storage and retrieval of data, making the product suitable for data intensive applications.

Output Enable: YES

The presence of an output enable feature allows for control over data output, increasing flexibility and usability of the product.

Technical Specifications

FIFO SN74ALVC3641-20PCB attributes and parameters. Explore more FIFO devices from Texas Instruments

Specs

Maximum Access Time:

11.5 ns

Cycle Time:

20 ns

JESD-30 Code:

S-PQFP-G120

Length:

14 mm

Memory Density:

36864 bit

Memory IC Type:

Memory Width:

36

No. of Functions:

1

No. of Terminals:

120

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1KX36

Output Enable:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP120,.63SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

FIFOs

Maximum Supply Current:

.35 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Trade Compliance

SN74ALVC3641-20PCB Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.71

SB

8542.32.00.70

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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