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SN74AHCT04PWG4

Texas Instruments

SN74AHCT04PWG4 by Texas Instruments

SN74AHCT04PWG4 by Texas Instruments is a CMOS logic gate with 6 functions, 8.5 ns propagation delay at 5V supply, and 50 pF load capacitance. It is used in automotive applications due to its small outline package and dual terminal position for high-speed signal processing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 111,891 parts In-Stock

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Vyrian

USA . 6,237 parts In-Stock

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Digiode

USA . 3,792 parts In-Stock

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AZTECH Wire

Italy . 206 parts In-Stock

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$15.810

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Parana Technologies

USA . 2,358 parts In-Stock

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$29.285

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$57.589

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DigiPath Technology Company

USA . 1,399 parts In-Stock

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$32.246

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$29.666

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ChromeModa Solutions

Germany . 4,133 parts In-Stock

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IDEA Electronic Components Group

UK . 113 parts In-Stock

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$31.259

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One Stop Electronics

USA . 1,491 parts In-Stock

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Component Stockers USA

USA . 608 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Overview

Unlock the power of reliable logic gates with the SN74AHCT04PWG4 by Texas Instruments. Designed with precision and expertise, this high-quality product offers a seamless solution for a variety of applications in electronics. From efficient signal processing to data transmission, this logic gate ensures optimal performance with minimal propagation delay. Trust in Texas Instruments for cutting-edge technology that delivers value and reliability, setting you up for success in your projects. Experience the difference with the SN74AHCT04PWG4 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to heat and moisture, making the product reliable in various operating conditions.

Propagation Delay At Nominal Supply: 8.5 ns

Low propagation delay ensures fast response times in logic operations, improving overall performance.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into circuit boards, saving time and effort in assembly.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with a wide range of devices and systems.

Maximum Operating Temperature: 125 °C

With a high operating temperature range, this product can be used in demanding environments without risk of overheating.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in digital logic circuits.

Technical Specifications

Logic Gates SN74AHCT04PWG4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

AHCT/VHCT/VT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

SN74AHCT04PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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