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SN74AC244DWG4

Texas Instruments

SN74AC244DWG4 by Texas Instruments

SN74AC244DWG4 by Texas Instruments is a 20-terminal bus driver with 10ns propagation delay at 3.3V, suitable for industrial applications. It features 2 functions, operates at -40 to 85°C, and has a max power supply current of 0.04mA. This CMOS technology device has a small outline package style and supports true output polarity in a surface-mount form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 8,350 parts In-Stock

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Vyrian

USA . 6,381 parts In-Stock

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Digiode

USA . 2,487 parts In-Stock

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Nova Conductors

Japan . 63 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 201 parts In-Stock

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$8.775

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$9.460

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201

$8.775

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$9.460

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DigiPath Technology Company

USA . 2,339 parts In-Stock

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$9.663

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$8.890

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$9.663

$8.890

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ChromeModa Solutions

Germany . 2,464 parts In-Stock

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$9.860

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$8.085

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$9.860

$8.085

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IDEA Electronic Components Group

UK . 45 parts In-Stock

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$9.860

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$9.367

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$8.874

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45

$9.860

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$8.874

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Corohmni

South Africa . 228 parts In-Stock

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$13.740

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AZTECH Wire

Italy . 283 parts In-Stock

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$18.587

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$18.587

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Ampacity Inc.

Singapore . 1,193 parts In-Stock

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$55.000

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One Stop Electronics

USA . 1,254 parts In-Stock

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$56.000

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Argo Parts USA

USA . 4,237 parts In-Stock

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Corphita

USA . 3,951 parts In-Stock

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Microchip USA

USA . 1,977 parts In-Stock

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Perfect Parts

USA . 1,064 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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Continental Prestige Electronics

USA . 141 parts In-Stock

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Overview

Enhance your electronics projects with the SN74AC244DWG4 by Texas Instruments. This high-quality bus driver and transceiver offers reliable performance and versatility for a wide range of applications. With a compact design and 3-state output characteristics, this product provides value and flexibility to customers looking for seamless integration and efficient signal transmission. Trust in Texas Instruments' expertise and innovation to deliver top-notch solutions for your engineering needs. Elevate your designs with the SN74AC244DWG4 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external factors, ensuring a longer lifespan.

Propagation Delay At Nominal Supply: 10 ns

The low propagation delay ensures fast and efficient communication within the bus system, reducing latency.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 2

Having multiple functions in a single component simplifies the circuit design and reduces the overall component count, ensuring cost-effectiveness.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a low supply voltage of 3.3V reduces power consumption and heat dissipation, making it energy-efficient.

Output Characteristics: 3-STATE

The 3-STATE output allows the bus driver to disconnect from the bus line, providing flexibility in controlling the bus signals.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels, ensuring reliable operation.

Technical Specifications

Bus Driver & Transceivers SN74AC244DWG4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Control Type:

ENABLE LOW

Count Direction:

UNIDIRECTIONAL

Family:

AC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.04 mA

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

10 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

N/A

Width:

7.5 mm

Trade Compliance

SN74AC244DWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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