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SN7400DRE4

Texas Instruments

SN7400DRE4 by Texas Instruments

SN7400DRE4 by Texas Instruments is a TTL logic gate with 4 functions and 2 inputs. It operates at a supply voltage of 5V, with a propagation delay of 22ns. This small outline package is ideal for commercial applications requiring fast signal processing in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,975 parts In-Stock

1+ parts

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4,975

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Digiode

USA . 3,555 parts In-Stock

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3,555

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Distributors (Availability)

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AZTECH Wire

Italy . 222 parts In-Stock

1+ parts

$7.228

100+ parts

-

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222

$7.228

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Parana Technologies

USA . 1,924 parts In-Stock

1+ parts

$18.233

100+ parts

-

1k+ parts

$18.369

10k+ parts

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1,924

$18.233

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$18.369

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ChromeModa Solutions

Germany . 770 parts In-Stock

1+ parts

$20.487

100+ parts

$16.799

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770

$20.487

$16.799

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IDEA Electronic Components Group

UK . 606 parts In-Stock

1+ parts

$20.487

100+ parts

$19.463

1k+ parts

$18.438

10k+ parts

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606

$20.487

$19.463

$18.438

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One Stop Electronics

USA . 1,355 parts In-Stock

1+ parts

$63.000

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1,355

$63.000

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Corphita

USA . 4,278 parts In-Stock

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4,278

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Microchip USA

USA . 417 parts In-Stock

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417

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DigiPath Technology Company

USA . 251 parts In-Stock

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$18.471

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251

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$18.471

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Overview

Elevate your electronic projects with the SN7400DRE4 logic gates from Texas Instruments, a leading manufacturer known for top-quality components. Ideal for various applications, these logic gates offer unmatched reliability and performance. With a low propagation delay at nominal supply and high power efficiency, this product ensures seamless operation. Whether you're a hobbyist or a professional, the SN7400DRE4 provides value, precision, and versatility, making it a must-have in your toolkit. Upgrade your designs today with Texas Instruments' cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material for the package body provides good durability and protection for the internal components of the logic gates.

Propagation Delay At Nominal Supply: 22 ns

Low propagation delay ensures fast processing of signals within the logic gates, leading to efficient performance.

Surface Mount: YES

Surface mount capability allows for easy and convenient integration of the logic gates onto circuit boards, saving space and reducing assembly time.

No. of Functions: 4

Having multiple functions in a single package increases versatility and functionality, making it a cost-effective solution for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard nominal supply voltage of 5V, making it compatible with a wide range of electronic systems and devices.

Load Capacitance (CL): 15 pF

Suitable load capacitance ensures stable and reliable performance of the logic gates in different circuit configurations.

Maximum Operating Temperature: 70 °C

High maximum operating temperature tolerance allows the logic gates to function reliably even under challenging environmental conditions.

Technology: TTL

TTL technology provides high-speed operation and low power consumption, making the logic gates efficient in digital applications.

Technical Specifications

Logic Gates SN7400DRE4 attributes and parameters. Explore more Logic Gates devices from Texas Instruments

Specs

Family:

TTL/H/L

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

16 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

22 mA

Propagation Delay At Nominal Supply:

22 ns

Propagation Delay (tpd):

22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

SN7400DRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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