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SN65LVCP40RGZTG4

Texas Instruments

SN65LVCP40RGZTG4 by Texas Instruments

SN65LVCP40RGZTG4 by Texas Instruments is a 48-terminal telecom IC with a 3.3V supply voltage and 4000 Mbps data rate. It operates in industrial temperatures (-40 to 85°C) and has a low supply current of 0.254 mA, making it ideal for telecom circuit applications requiring high-speed data transmission. The chip carrier package style with very thin profile and surface mount capability ensures efficient integration into compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,949 parts In-Stock

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Digiode

USA . 3,380 parts In-Stock

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USA . 3,010 parts In-Stock

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AZTECH Wire

Italy . 622 parts In-Stock

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$4.935

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Parana Technologies

USA . 1,885 parts In-Stock

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$15.687

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$16.057

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DigiPath Technology Company

USA . 2,056 parts In-Stock

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$17.273

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$15.892

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ChromeModa Solutions

Germany . 6,231 parts In-Stock

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$17.626

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$14.453

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IDEA Electronic Components Group

UK . 73 parts In-Stock

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$17.626

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$16.745

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$15.863

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73

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One Stop Electronics

USA . 916 parts In-Stock

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$734.000

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Corphita

USA . 2,105 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Enhance your telecom systems with the SN65LVCP40RGZTG4 by Texas Instruments, a top-quality Other Function Telecom Interface IC. Designed with precision and reliability in mind, Texas Instruments delivers cutting-edge technology that ensures seamless communication in various applications. With a compact square package and industrial-grade temperature range, this chip carrier offers unmatched performance and efficiency. Elevate your projects with the SN65LVCP40RGZTG4 and experience the value of superior connectivity solutions for your business needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the telecom interface IC, ensuring reliable performance over time.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation on circuit boards, saving time and effort during production.

Power Supplies (V): 3.3

With a power supply of 3.3V, this telecom interface IC is compatible with a wide range of electronic systems and applications.

No. of Terminals: 48

The 48 terminals provide ample connectivity options, allowing for versatile and flexible integration into telecom systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable operation even in demanding industrial environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold terminal finish enhances conductivity and reliability, reducing the risk of signal loss or degradation.

Data Rate: 4000 Mbps

With a high data rate of 4000 Mbps, this telecom IC can process and transmit data quickly and efficiently, making it suitable for high-speed communication applications.

Technical Specifications

Other Function Telecom Interface ICs SN65LVCP40RGZTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

Data Rate:

4000 Mbps

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Telecom ICs

Maximum Supply Current:

.254 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

SN65LVCP40RGZTG4 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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