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RM46L450ZWTT

Texas Instruments

RM46L450ZWTT by Texas Instruments

Texas Instruments RM46L450ZWTT microcontroller features 32-bit CPU, 13-bit address bus, and 1048576 ROM words. Ideal for industrial applications with peripherals like DMA(16), PWM(14), TIMER(45), and connectivity options such as CAN, ETHERNET, I2C, SCI, SPI, USB. Operating temperature range from -40 to 105 °C with a max clock frequency of 80 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,966 parts In-Stock

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Digiode

USA . 3,642 parts In-Stock

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3,642

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Distributors (Availability)

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AZTECH Wire

Italy . 243 parts In-Stock

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$10.246

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243

$10.246

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One Stop Electronics

USA . 1,634 parts In-Stock

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$30.000

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Parana Technologies

USA . 832 parts In-Stock

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$43.778

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832

$43.778

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ChromeModa Solutions

Germany . 4,808 parts In-Stock

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$49.189

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$40.335

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4,808

$49.189

$40.335

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IDEA Electronic Components Group

UK . 604 parts In-Stock

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$49.189

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$46.730

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$44.270

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604

$49.189

$46.730

$44.270

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DigiPath Technology Company

USA . 1,967 parts In-Stock

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$44.349

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Corphita

USA . 274 parts In-Stock

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Microchip USA

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Overview

Elevate your projects with the RM46L450ZWTT microcontroller by Texas Instruments. This cutting-edge device boasts top-tier quality and is perfect for a wide range of applications. From automotive to industrial, this microcontroller offers unmatched performance and reliability. With Texas Instruments' reputation for excellence, you can trust that this product will exceed your expectations. Unlock endless possibilities and streamline your processes with the RM46L450ZWTT microcontroller - the ultimate solution for all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material ensures durability and shock resistance, making the microcontroller suitable for rugged applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving space and reducing production costs.

Maximum Supply Voltage: 1.32 V

A high maximum supply voltage of 1.32 V allows for flexibility in power supply options while ensuring stable operation.

Address Bus Width: 13

A wide address bus width of 13 allows for efficient memory addressing and data handling, enhancing overall performance.

Bit Size: 32

32-bit architecture provides high processing power and advanced capabilities for running complex algorithms and tasks.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages (1.2V and 3.3V) enables compatibility with a wide range of power sources for versatile applications.

No. of Terminals: 337

A high number of terminals allows for enhanced connectivity options and peripheral integration, enabling versatile design possibilities.

Maximum Operating Temperature: 105 °C

A high maximum operating temperature of 105°C ensures reliable performance even in harsh environmental conditions.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family offers high performance and efficiency, making the microcontroller suitable for real-time applications and tasks.

ADC Channels: YES

Built-in ADC channels enable the microcontroller to convert analog signals to digital data, facilitating sensor integration and data acquisition.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture in a microcontroller design ensures efficient processing and high performance for a wide range of applications.

RAM Bytes: 131072

A large RAM capacity of 131072 bytes allows for efficient data storage and processing, enhancing the microcontroller's capability to handle complex tasks.

Technical Specifications

Microcontrollers RM46L450ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

101

No. of Terminals:

337

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(5), USB(2)

Peripherals:

DMA(16), POR, PWM(14), TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM46L450ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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