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RM46L840CZWTT

Texas Instruments

RM46L840CZWTT by Texas Instruments

Texas Instruments RM46L840CZWTT microcontroller features 32-bit architecture, 80 MHz clock frequency, and 24-Ch 12-Bit ADC. Ideal for industrial applications requiring high-speed data processing, it offers low power mode, CAN, Ethernet connectivity, and extensive peripheral support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,357 parts In-Stock

1+ parts

-

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3,357

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Digiode

USA . 3,086 parts In-Stock

1+ parts

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3,086

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 243 parts In-Stock

1+ parts

$9.000

100+ parts

-

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243

$9.000

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AZTECH Wire

Italy . 456 parts In-Stock

1+ parts

$12.762

100+ parts

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456

$12.762

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Parana Technologies

USA . 80 parts In-Stock

1+ parts

$32.110

100+ parts

-

1k+ parts

$97.993

10k+ parts

-

80

$32.110

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$97.993

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DigiPath Technology Company

USA . 625 parts In-Stock

1+ parts

$35.357

100+ parts

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625

$35.357

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ChromeModa Solutions

Germany . 5,534 parts In-Stock

1+ parts

$36.079

100+ parts

$29.585

1k+ parts

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10k+ parts

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5,534

$36.079

$29.585

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IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$36.079

100+ parts

$34.275

1k+ parts

$32.471

10k+ parts

-

609

$36.079

$34.275

$32.471

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Microchip USA

USA . 2,782 parts In-Stock

1+ parts

$56.280

100+ parts

$55.300

1k+ parts

$54.810

10k+ parts

$54.320

2,782

$56.280

$55.300

$54.810

$54.320

Component Stockers USA

USA . 343 parts In-Stock

1+ parts

$325.500

100+ parts

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343

$325.500

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Corphita

USA . 4,583 parts In-Stock

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4,583

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Overview

Experience unparalleled performance and reliability with the Texas Instruments RM46L840CZWTT microcontroller. As a leader in the industry, Texas Instruments ensures top-notch quality and cutting-edge technology in their products. This versatile microcontroller is perfect for a wide range of applications, from automotive to industrial. With integrated cache, advanced peripherals, and low power modes, this microcontroller offers exceptional value and benefits to customers looking for high performance and efficiency. Upgrade your projects with the RM46L840CZWTT and take advantage of its superior features for an unmatched experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Integrated Cache: YES

Improves overall system performance by storing frequently accessed data for faster retrieval.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in power supply options while maintaining safe operating conditions.

On Chip Data RAM Width: 8

Enables efficient data processing and manipulation within the microcontroller.

Address Bus Width: 13

Supports a larger memory address space, allowing for more complex applications to be run on the microcontroller.

Bit Size: 32

High bit size ensures compatibility with a wide range of development tools and programming languages.

No. of Terminals: 337

Provides ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Facilitates compact and efficient PCB layout design, saving valuable board space.

Minimum Supply Voltage: 1.14 V

Allows for operation in low-power scenarios while maintaining stable performance.

Maximum Operating Temperature: 105 °C

Ensures reliable operation in harsh environmental conditions without compromising performance.

No. of External Interrupts: 16

Enables the microcontroller to respond quickly to external events and real-time signals.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a Reduced Instruction Set Computing architecture for efficient data processing and execution.

Technical Specifications

Microcontrollers RM46L840CZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

16

No. of I/O Lines:

101

No. of Serial I/Os:

9

No. of Terminals:

337

No. of Timers:

41

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

RAM Words:

192

ROM Words:

1310720

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Maximum Supply Current:

455 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(5)

Peripherals:

DMA(16), POR, PWM(14), TIMER(45), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM46L840CZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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