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RM46L450CPGET

Texas Instruments

RM46L450CPGET by Texas Instruments

Texas Instruments RM46L450CPGET microcontroller features 32-bit architecture, 80 MHz clock frequency, and 24-Ch 12-Bit ADC. Ideal for industrial applications requiring high-speed data processing, with connectivity options including CAN, Ethernet, I2C, SCI, SPI, and USB interfaces. Low power mode enhances energy efficiency while offering a wide range of peripherals like DMA and PWM channels.

Median Price

$22.370

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 350 parts In-Stock

1+ parts

$22.370

100+ parts

$19.540

1k+ parts

$13.476

10k+ parts

-

350

$22.370

$19.540

$13.476

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,474 parts In-Stock

1+ parts

$21.252

100+ parts

-

1k+ parts

-

10k+ parts

-

4,474

$21.252

-

-

-

Nova Conductors

Japan . 94 parts In-Stock

1+ parts

$24.055

100+ parts

-

1k+ parts

-

10k+ parts

-

94

$24.055

-

-

-

Vyrian

USA . 4,098 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,098

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 874 parts In-Stock

1+ parts

$5.924

100+ parts

-

1k+ parts

-

10k+ parts

-

874

$5.924

-

-

-

Ampacity Inc.

Singapore . 71 parts In-Stock

1+ parts

$19.010

100+ parts

-

1k+ parts

-

10k+ parts

-

71

$19.010

-

-

-

Corphita

USA . 1,811 parts In-Stock

1+ parts

$20.133

100+ parts

-

1k+ parts

-

10k+ parts

-

1,811

$20.133

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$23.574

100+ parts

-

1k+ parts

$22.631

10k+ parts

-

2,000

$23.574

-

$22.631

-

Parana Technologies

USA . 2,207 parts In-Stock

1+ parts

$50.171

100+ parts

-

1k+ parts

-

10k+ parts

-

2,207

$50.171

-

-

-

DigiPath Technology Company

USA . 904 parts In-Stock

1+ parts

$55.245

100+ parts

-

1k+ parts

-

10k+ parts

-

904

$55.245

-

-

-

Microchip USA

USA . 1,649 parts In-Stock

1+ parts

$55.330

100+ parts

$54.360

1k+ parts

$53.880

10k+ parts

$53.400

1,649

$55.330

$54.360

$53.880

$53.400

ChromeModa Solutions

Germany . 6,290 parts In-Stock

1+ parts

$56.372

100+ parts

$46.225

1k+ parts

-

10k+ parts

-

6,290

$56.372

$46.225

-

-

IDEA Electronic Components Group

UK . 474 parts In-Stock

1+ parts

$56.372

100+ parts

$53.553

1k+ parts

$50.735

10k+ parts

-

474

$56.372

$53.553

$50.735

-

Overview

The RM46L450CPGET by Texas Instruments is a game-changer in the world of microcontrollers, offering unrivaled quality and reliability. With advanced technology and cutting-edge features, this device is ideal for a wide range of applications. From industrial automation to automotive systems, this product delivers exceptional performance and efficiency. Trust Texas Instruments to provide you with the best-in-class solutions that will take your projects to the next level. Upgrade to the RM46L450CPGET today and experience the value and benefits it has to offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and cost-effective.

Integrated Cache: YES

The integrated cache enhances the performance and efficiency of the microcontroller.

Surface Mount: YES

The surface mount feature simplifies the assembly process and saves space on the PCB.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures safe and reliable operation of the microcontroller.

On Chip Data RAM Width: 8

The on-chip data RAM width of 8 improves data processing speed and efficiency.

Package Shape: SQUARE

The square package shape allows for easier integration into various electronic devices.

Bit Size: 32

The 32-bit size provides high processing power and performance capabilities.

No. of Terminals: 144

The high number of terminals allow for versatile connectivity options in complex systems.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, fine pitch package style ensures efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures energy efficiency and extends battery life.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C allows for reliable operation in harsh environments.

CPU Family: CORTEX-R4F

The Cortex-R4F CPU family provides high-performance processing capabilities for demanding applications.

No. of External Interrupts: 10

The 10 external interrupts allow for efficient handling of external events and tasks.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable performance in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data for processing.

DMA Channels: YES

The availability of DMA channels allows for efficient data transfer and management without CPU intervention.

Terminal Position: QUAD

The quad terminal position simplifies the connection process and ensures a secure fit on the PCB.

ROM Words: 1048576

The large ROM memory capacity of 1048576 words allows for storing a significant amount of program data.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm allows for compact and slim device designs.

RAM Words: 128

The 128 RAM words provide sufficient memory for storing and accessing data during operation.

Width: 20 mm

The compact width of 20 mm makes the microcontroller suitable for space-constrained applications.

Data EEPROM Size: 64K

The 64K data EEPROM size allows for non-volatile data storage for critical information.

Boundary Scan: YES

The boundary scan feature enables efficient testing and diagnosis of the microcontroller's connections and components.

Technical Specifications

Microcontrollers RM46L450CPGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

10

No. of I/O Lines:

64

No. of Serial I/Os:

12

No. of Terminals:

144

No. of Timers:

41

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

131072

RAM Words:

128

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Current:

455 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(4), USB(2)

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM46L450CPGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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