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RM46L440ZWTT

Texas Instruments

RM46L440ZWTT by Texas Instruments

Texas Instruments RM46L440ZWTT microcontroller features 32-bit CPU CORTEX-R4F, 13-bit address bus, and 1.2-3.3V power supplies. Ideal for industrial applications requiring high-speed processing with a max clock frequency of 80MHz and extensive I/O capabilities with 16 PWM channels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,029 parts In-Stock

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6,029

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Digiode

USA . 3,033 parts In-Stock

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3,033

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Distributors (Availability)

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AZTECH Wire

Italy . 437 parts In-Stock

1+ parts

$7.568

100+ parts

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437

$7.568

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One Stop Electronics

USA . 1,248 parts In-Stock

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$24.000

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$24.000

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Parana Technologies

USA . 1,342 parts In-Stock

1+ parts

$42.251

100+ parts

$3,923.643

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$38.026

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1,342

$42.251

$3,923.643

$38.026

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$46.524

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2,156

$46.524

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ChromeModa Solutions

Germany . 3,609 parts In-Stock

1+ parts

$47.473

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$38.928

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3,609

$47.473

$38.928

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IDEA Electronic Components Group

UK . 1,631 parts In-Stock

1+ parts

$47.473

100+ parts

$45.099

1k+ parts

$42.726

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1,631

$47.473

$45.099

$42.726

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Microchip USA

USA . 470 parts In-Stock

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470

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Corphita

USA . 136 parts In-Stock

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Overview

Upgrade your projects with the RM46L440ZWTT microcontroller from Texas Instruments, a leading manufacturer known for top-quality components. Designed for a wide range of applications, this powerful device offers customers unparalleled value and benefits. With its advanced features and reliable performance, this microcontroller is perfect for powering your next innovation. Experience the advantages of cutting-edge technology and unleash your creativity with the RM46L440ZWTT today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for easy handling and long-lasting use.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.32 V

Efficient power usage and protection against voltage spikes.

Address Bus Width: 13

Ability to address a large memory space for complex applications.

Bit Size: 32

High processing capability for handling demanding tasks and computations.

Power Supplies (V): 1.2,3.3

Support for multiple power supply options to suit different system requirements.

No. of Terminals: 337

Sufficient connectivity options for interfacing with various components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Compact package design for space-saving layouts and efficient signal routing.

Minimum Supply Voltage: 1.14 V

Reliable operation even at low voltage levels to ensure system stability.

Maximum Operating Temperature: 105 °C

Capability to withstand high temperature environments for versatile applications.

CPU Family: CORTEX-R4F

High-performance Cortex-R4F processor for fast and reliable processing tasks.

Minimum Operating Temperature: -40 °C

Suitable for operation in extreme cold conditions without performance degradation.

Terminal Finish: TIN SILVER COPPER

Corrosion-resistant terminal finish for long-term reliability and durability.

ADC Channels: YES

Integrated Analog-to-Digital Converter for capturing and processing analog signals.

DMA Channels: YES

Direct Memory Access support for efficient data transfer and processing.

Terminal Position: BOTTOM

Convenient terminal placement for easy access and connection to external devices.

ROM Words: 1048576

Large Read-Only Memory capacity for storing program instructions and data.

Maximum Seated Height: 1.4 mm

Low profile package design for compact and slim applications.

Width: 16 mm

Optimal width dimension for fitting into standard circuit board layouts.

External Data Bus Width: 16

Efficient data transfer capability with a 16-bit external data bus.

Maximum Clock Frequency: 80 MHz

High clock frequency for fast processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 30

Reflow soldering time limit ensures proper assembly and solder joint quality.

Peak Reflow Temperature °C: 260

Suitable reflow temperature for reliable soldering and component attachment.

Length: 16 mm

Compact length dimension for space-efficient circuit board designs.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating for robust performance in harsh environments.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design for efficient and streamlined processing tasks.

RAM Bytes: 131072

Ample Random Access Memory for buffering and temporary data storage.

Technology: CMOS

CMOS technology for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable solder joints and electrical connections.

Maximum Supply Current: 400 mA

Support for moderate supply current requirements to drive various components.

Nominal Supply Voltage: 1.2 V

Stable nominal voltage supply for consistent and reliable operation.

PWM Channels: YES

Pulse-Width Modulation channels for precise control of analog signals.

ROM Programmability: FLASH

Flash ROM programmability for flexible and easy updates of firmware and software.

Terminal Pitch: 0.8 mm

Optimal terminal pitch for compatibility with standard soldering and mounting techniques.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 for safe storage and handling in typical production environments.

Speed: 200 rpm

200 rotations per minute speed for efficient data processing and communication.

No. of I/O Lines: 16

Sufficient input/output lines for interfacing with peripherals and external devices.

Technical Specifications

Microcontrollers RM46L440ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

RM46L440ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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