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RM46L830ZWTT

Texas Instruments

RM46L830ZWTT by Texas Instruments

The Texas Instruments RM46L830ZWTT microcontroller features a 32-bit CPU with Cortex-R4F family, 196608 bytes of RAM, and 1310720 ROM words. With a max clock frequency of 80 MHz, it is suitable for industrial applications requiring high-speed processing and extensive memory capabilities. This microcontroller also offers ADC and DMA channels for efficient data acquisition and transfer.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,728 parts In-Stock

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2,728

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Digiode

USA . 451 parts In-Stock

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451

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Distributors (Availability)

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AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$12.470

100+ parts

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494

$12.470

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Ampacity Inc.

Singapore . 1,518 parts In-Stock

1+ parts

$27.000

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1,518

$27.000

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One Stop Electronics

USA . 917 parts In-Stock

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$27.000

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917

$27.000

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Parana Technologies

USA . 455 parts In-Stock

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$49.545

100+ parts

$4,600.960

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$44.590

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455

$49.545

$4,600.960

$44.590

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DigiPath Technology Company

USA . 159 parts In-Stock

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$54.555

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159

$54.555

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IDEA Electronic Components Group

UK . 1,991 parts In-Stock

1+ parts

$55.668

100+ parts

$52.885

1k+ parts

$50.101

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1,991

$55.668

$52.885

$50.101

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ChromeModa Solutions

Germany . 1,069 parts In-Stock

1+ parts

$55.668

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$45.648

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1,069

$55.668

$45.648

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Corphita

USA . 1,548 parts In-Stock

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1,548

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Microchip USA

USA . 496 parts In-Stock

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496

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Overview

Elevate your projects with the RM46L830ZWTT microcontroller from Texas Instruments. With a reputation for excellence, TI delivers top-notch quality and reliability in the world of microcontrollers. Whether you're working on automotive applications, industrial control systems, or consumer electronics, this versatile device offers unparalleled value and performance. Take advantage of its advanced features, efficient power management, and seamless integration to bring your creations to life. Trust in TI to provide cutting-edge technology that pushes boundaries and drives innovation.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount:

YES - Allows for easy and efficient installation on a circuit board, saving time and space.

Maximum Supply Voltage:

1.32 V - Supports a wide range of input voltages, making the microcontroller versatile and compatible with different power sources.

Address Bus Width:

13 - Enables efficient memory addressing and data transfer within the microcontroller, enhancing its performance.

Package Shape:

SQUARE - Offers a compact and space-saving design, ideal for applications with limited board space.

Bit Size:

32 - Provides high computational power and efficiency for processing complex tasks quickly.

Power Supplies (V):

1.2,3.3 - Allows for flexibility in power options, accommodating different voltage requirements in various applications.

No. of Terminals:

337 - Provides ample connectivity options for interfacing with other components or peripherals in a system.

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH - Enhances the reliability and connection integrity of the microcontroller on the PCB.

Minimum Supply Voltage:

1.14 V - Ensures stable performance even under low voltage conditions, improving reliability in different operating environments.

Maximum Operating Temperature:

105 °C - Offers a wide temperature range for operation, making the microcontroller suitable for industrial use and harsh conditions.

CPU Family:

CORTEX-R4F - Belongs to a robust and efficient processor family, ensuring high performance and reliability in demanding applications.

Minimum Operating Temperature:

40 °C - Allows for operation in extreme cold environments, expanding the range of applications where the microcontroller can be used.

Terminal Finish:

TIN SILVER COPPER - Provides excellent conductivity and corrosion resistance for reliable connections and long-term durability.

ADC Channels:

YES - Enables analog-to-digital conversion, allowing the microcontroller to interface with analog sensors and signals.

DMA Channels:

YES - Supports direct memory access for efficient data transfer without CPU intervention, enhancing overall system performance.

Terminal Position:

BOTTOM - Facilitates easy assembly and connection with other components on the PCB, simplifying the manufacturing process.

ROM Words:

1310720 - Offers large programmable memory space for storing firmware and data, accommodating complex algorithms and applications.

Maximum Seated Height:

1.4 mm - Provides a low-profile design for space-constrained applications, ensuring compatibility with compact devices.

Width:

16 mm - Compact width dimension for the microcontroller, suitable for applications with limited board space.

External Data Bus Width:

16 - Efficient data transfer between the microcontroller and external memory or peripherals, enhancing system performance.

Maximum Clock Frequency:

80 MHz - Supports high-speed operation for quick processing and response time, suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s):

30 - Ensures proper soldering and assembly during manufacturing, improving the reliability of the microcontroller.

Peak Reflow Temperature °C:

260 - Withstands high-temperature reflow soldering processes, ensuring robust connections on the PCB.

Length:

16 mm - Compact length dimension for the microcontroller, suitable for space-efficient designs and applications.

Temperature Grade:

INDUSTRIAL - Designed for industrial environments with extended temperature ranges and reliability standards.

Peripheral IC Type:

MICROCONTROLLER, RISC - Features a RISC architecture for efficient and high-performance computing, suitable for a wide range of applications.

RAM Bytes:

196608 - Provides ample random access memory for storing data and variables during operation, supporting complex algorithms and applications.

Technology:

CMOS - Utilizes CMOS technology for low power consumption and high speed, making the microcontroller energy-efficient and reliable.

Terminal Form:

BALL - Ball grid array terminal forms for reliable and secure connections with the PCB, ensuring stable operation in various conditions.

Maximum Supply Current:

400 mA - Supports a maximum current draw for powering external peripherals or components, making the microcontroller versatile in different applications.

Nominal Supply Voltage:

1.2 V - Standard nominal voltage for efficient and stable operation, ensuring compatibility with various power sources.

PWM Channels:

YES - Provides pulse-width modulation channels for precise control of output signals, suitable for motor control and analog signal generation.

ROM Programmability:

FLASH - Flash memory programmability for easy firmware updates and reprogramming, ensuring flexibility and scalability in applications.

Terminal Pitch:

0.8 mm - Fine pitch terminal spacing for compact and space-saving layouts on the PCB, ideal for miniaturized designs.

Moisture Sensitivity Level (MSL):

3 - MSL level 3 for reflow soldering reliability, ensuring proper handling and storage of the microcontroller.

Speed:

200 rpm - Supports high-speed operation for quick data processing and control, improving overall system performance.

No. of I/O Lines:

16 - Provides a sufficient number of input/output lines for interfacing with external devices and peripherals, enhancing system connectivity.

Technical Specifications

Microcontrollers RM46L830ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1310720

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

RM46L830ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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