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RM46L450PGET

Texas Instruments

RM46L450PGET by Texas Instruments

Texas Instruments RM46L450PGET microcontroller features 32-bit CPU, 1048576 ROM words, and 64K data EEPROM. With 24-Ch 12-Bit ADCs, it supports CAN, ETHERNET, I2C, SCI, SPI, USB connectivity for industrial applications requiring up to 80 MHz clock frequency. The package is a low-profile flatpack with fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,304 parts In-Stock

1+ parts

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5,304

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Digiode

USA . 719 parts In-Stock

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719

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Distributors (Availability)

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AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$12.527

100+ parts

-

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622

$12.527

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One Stop Electronics

USA . 1,237 parts In-Stock

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$28.000

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1,237

$28.000

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Parana Technologies

USA . 2,365 parts In-Stock

1+ parts

$57.639

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2,365

$57.639

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ChromeModa Solutions

Germany . 2,686 parts In-Stock

1+ parts

$64.763

100+ parts

$53.106

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2,686

$64.763

$53.106

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IDEA Electronic Components Group

UK . 656 parts In-Stock

1+ parts

$64.763

100+ parts

$61.525

1k+ parts

$58.287

10k+ parts

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656

$64.763

$61.525

$58.287

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Corphita

USA . 2,488 parts In-Stock

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2,488

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DigiPath Technology Company

USA . 165 parts In-Stock

1+ parts

-

100+ parts

$58.390

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165

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$58.390

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Microchip USA

USA . 141 parts In-Stock

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141

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Overview

Unlock the power of innovation with the RM46L450PGET microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. Ideal for a wide range of applications, this microcontroller offers advanced features and capabilities to meet your unique needs. Experience the value and benefits of seamless connectivity, high performance, and efficient operation. Trust Texas Instruments to provide cutting-edge technology that drives success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the product suitable for various environments.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options.

CPU Family: CORTEX-R4F

The Cortex-R4F family offers high performance and efficiency, enhancing the overall functionality of the product.

ADC Channels: YES

The presence of analog to digital converters enables the product to interface with sensor inputs, expanding its range of applications.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture enhances the speed and efficiency of the microcontroller, allowing for faster processing of tasks.

Connectivity: CAN(3), ETHERNET, I2C, SCI(2), SPI(4), USB(2)

Multiple connectivity options such as Ethernet, SPI, and USB allow for versatile communication interfaces, enabling seamless integration with various devices.

Technical Specifications

Microcontrollers RM46L450PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

144

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), ETHERNET, I2C, SCI(2), SPI(4), USB(2)

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM46L450PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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