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RM46L830CPGET

Texas Instruments

RM46L830CPGET by Texas Instruments

RM46L830CPGET by Texas Instruments is a 32-bit microcontroller with 144 terminals, operating at up to 80 MHz. It features 24 ADC channels, 16 DMA channels, and connectivity options like CAN, I2C, SCI, SPI, and USB. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

$22.181

Lifecycle Status

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4

In-Stock Inventory

1k+

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Texas Instruments

USA . 102 parts In-Stock

1+ parts

$22.181

100+ parts

$19.375

1k+ parts

$13.362

10k+ parts

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102

$22.181

$19.375

$13.362

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Nova Conductors

Japan . 50 parts In-Stock

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$18.607

100+ parts

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50

$18.607

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Digiode

USA . 2,026 parts In-Stock

1+ parts

$21.072

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2,026

$21.072

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Vyrian

USA . 4,775 parts In-Stock

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4,775

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AZTECH Wire

Italy . 335 parts In-Stock

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$12.657

100+ parts

-

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335

$12.657

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Ampacity Inc.

Singapore . 102 parts In-Stock

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$18.850

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102

$18.850

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Corphita

USA . 3,396 parts In-Stock

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$19.963

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3,396

$19.963

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Parana Technologies

USA . 1,145 parts In-Stock

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$28.297

100+ parts

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$45.875

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1,145

$28.297

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$45.875

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IDEA Electronic Components Group

UK . 1,397 parts In-Stock

1+ parts

$31.794

100+ parts

$30.204

1k+ parts

$28.615

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1,397

$31.794

$30.204

$28.615

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ChromeModa Solutions

Germany . 227 parts In-Stock

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$31.794

100+ parts

$26.071

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$31.794

$26.071

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Kepictronics

USA . 2,500 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

$18.234

1k+ parts

$17.676

10k+ parts

$17.304

2,000

-

$18.234

$17.676

$17.304

DigiPath Technology Company

USA . 1,001 parts In-Stock

1+ parts

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$28.665

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1,001

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$28.665

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Perfect Parts

USA . 336 parts In-Stock

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336

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Overview

Discover the RM46L830CPGET by Texas Instruments, a top-quality microcontroller designed to meet your industrial needs. With a reliable manufacturer like Texas Instruments, this product offers outstanding performance and durability. Ideal for a wide range of applications, this microcontroller provides advanced features such as DMA channels, PWM functionality, and multiple connectivity options. Experience the value and benefits of this product, from its low power mode to its fast clock frequency, making it a versatile and efficient solution for your projects. Upgrade to the RM46L830CPGET and unlock endless possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good physical protection for the microcontroller, making it durable and reliable for various applications.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards, saving time during production.

Maximum Supply Voltage: 1.32 V

Ensures safe operation within the specified voltage range to prevent damage to the microcontroller.

On Chip Data RAM Width: 8

Offers sufficient memory space for data storage and processing, enhancing the performance of the microcontroller.

Package Shape: SQUARE

Facilitates a compact and space-saving design for the microcontroller, ideal for applications with limited space.

Bit Size: 32

Provides high computational capabilities and processing power, suitable for demanding tasks and applications.

No. of Terminals: 144

Offers ample connectivity options for external devices and peripherals, increasing the versatility of the microcontroller.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables easy installation and integration into various electronic devices, making it a versatile choice for different products.

Minimum Supply Voltage: 1.14 V

Operating within a low voltage range allows for energy-efficient performance, suitable for battery-powered applications.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, making it suitable for industrial environments and applications where heat resistance is crucial.

CPU Family: CORTEX-R4F

Utilizes advanced Cortex-R4F architecture for efficient processing power and performance, meeting the demands of modern applications.

No. of External Interrupts: 2

Supports external interrupt handling, enabling real-time response to events and enhancing the microcontroller's versatility.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, suitable for applications in harsh environments or climates.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures stable electrical connections, enhancing the reliability and longevity of the microcontroller.

ADC Channels: YES

Includes analog-to-digital converters for converting external signals into digital data, expanding the range of applications the microcontroller can support.

DMA Channels: YES

Supports direct memory access for efficient data transfer, reducing the burden on the CPU and improving overall system performance.

Terminal Position: QUAD

Offers easy access to terminals for connection to external devices, simplifying the integration process in electronic systems.

ROM Words: 1310720

Ample read-only memory capacity for storing program instructions and data, enabling the microcontroller to run complex applications smoothly.

Maximum Seated Height: 1.6 mm

Low-profile design facilitates compact device form factors, suitable for slim and space-constrained applications.

RAM Words: 192

Provides sufficient random-access memory for data storage and processing, ensuring smooth operation of the microcontroller.

Width: 20 mm

Compact dimensions make it suitable for applications where space is limited, offering flexibility in design and integration.

Data EEPROM Size: 64K

Large EEPROM size for storing non-volatile data, preserving important information even when power is removed.

Boundary Scan: YES

Supports boundary scan testing for easy debugging and troubleshooting during production and maintenance processes.

Peripherals: DMA(16), POR, PWM(14), TIMER(41), WDT

Rich set of peripherals enhance the microcontroller's capabilities, allowing it to support a wide range of functions and features for diverse applications.

Maximum Clock Frequency: 80 MHz

High clock frequency for fast processing and response times, suitable for applications with stringent timing requirements.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for reliable soldering during assembly without damaging the microcontroller, ensuring robust connections.

Peak Reflow Temperature °C: 260

Soldering temperature tolerance for standard reflow processes, enabling easy integration into circuit boards.

Length: 20 mm

Compact dimensions allow for versatile placement in electronic devices, contributing to efficient PCB layout and design.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with extended temperature ranges, suited for rugged applications.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient processing and power consumption, making it suitable for a wide range of applications.

No. of Timers: 41

Multiple timer channels for timing and scheduling tasks, enhancing the microcontroller's versatility in handling various operations.

RAM Bytes: 196608

Large RAM capacity for data storage and manipulation, supporting complex algorithms and calculations in diverse applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, ensuring efficient and reliable operation of the microcontroller.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections, making installation and maintenance easier for circuit board integration.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple ADC channels with high resolution for accurate analog signal conversion, enabling precise measurement and control in various applications.

Maximum Supply Current: 455 mA

Capable of providing sufficient power for the microcontroller and connected peripherals, ensuring stable and reliable operation.

Nominal Supply Voltage: 1.2 V

Stable supply voltage for consistent performance and reliable operation, crucial for maintaining system integrity in various applications.

No. of DMA Channels: 16

Multiple DMA channels for efficient data transfer and processing, reducing CPU load and improving overall system performance.

No. of Serial I/Os: 5

Includes serial I/O interfaces for communication with external devices, expanding connectivity options for versatile application support.

PWM Channels: YES

Supports pulse-width modulation for precise control of connected devices, enabling dynamic and efficient power management.

Connectivity: CAN(3), I2C, SCI(2), SPI(4), USB(2)

Offers a wide range of communication interfaces for connecting to various devices and peripherals, enhancing the microcontroller's versatility.

ROM Programmability: FLASH

Flash ROM for easy programmability and flexibility, allowing for convenient updates and modifications to the microcontroller's firmware.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact design and efficient board layout, suitable for space-constrained applications.

Format: FLOATING POINT

Supports floating-point arithmetic for high precision calculations, essential for numerical accuracy in scientific and engineering applications.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling procedures to prevent damage during storage and assembly.

Speed: 200 rpm

Capable of processing tasks at high speeds, suitable for applications requiring rapid data processing and response times.

Low Power Mode: YES

Includes low power modes for energy-efficient operation, extending battery life and reducing overall power consumption.

On Chip Program ROM Width: 8

Sufficient width for on-chip program storage, enabling faster access to instructions and data for efficient execution of tasks.

Technical Specifications

Microcontrollers RM46L830CPGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

2

No. of I/O Lines:

64

No. of Serial I/Os:

5

No. of Terminals:

144

No. of Timers:

41

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

196608

RAM Words:

192

ROM Words:

1310720

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Maximum Supply Current:

455 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

64K

Connectivity:

CAN(3), I2C, SCI(2), SPI(4), USB(2)

Peripherals:

DMA(16), POR, PWM(14), TIMER(41), WDT

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

RM46L830CPGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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