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RM46L840PGET

Texas Instruments

RM46L840PGET by Texas Instruments

Texas Instruments RM46L840PGET microcontroller features 32-bit CPU CORTEX-R4F, 13-bit address bus, and 80 MHz clock frequency. Ideal for industrial applications requiring high-speed processing, with ADC and DMA channels for efficient data handling. Package style: flatpack, low profile, fine pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,483 parts In-Stock

1+ parts

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9,483

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Digiode

USA . 4,042 parts In-Stock

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4,042

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,437 parts In-Stock

1+ parts

$3.000

100+ parts

-

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1,437

$3.000

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AZTECH Wire

Italy . 427 parts In-Stock

1+ parts

$14.715

100+ parts

-

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427

$14.715

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Parana Technologies

USA . 83 parts In-Stock

1+ parts

$57.693

100+ parts

-

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83

$57.693

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DigiPath Technology Company

USA . 2,146 parts In-Stock

1+ parts

$63.528

100+ parts

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2,146

$63.528

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ChromeModa Solutions

Germany . 2,024 parts In-Stock

1+ parts

$64.824

100+ parts

$53.156

1k+ parts

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10k+ parts

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2,024

$64.824

$53.156

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IDEA Electronic Components Group

UK . 580 parts In-Stock

1+ parts

$64.824

100+ parts

$61.583

1k+ parts

$58.342

10k+ parts

-

580

$64.824

$61.583

$58.342

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Corphita

USA . 3,590 parts In-Stock

1+ parts

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3,590

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Microchip USA

USA . 220 parts In-Stock

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220

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Overview

Unleash the power of innovation with the RM46L840PGET microcontroller from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that set the standard for excellence. This versatile microcontroller is perfect for a wide range of applications, offering unmatched performance and reliability. Experience the value and benefits that this product brings to your projects, with advanced features and cutting-edge technology that will take your designs to the next level. Elevate your creations with the RM46L840PGET and unlock endless possibilities for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring long-term reliability in various environments.

Maximum Supply Voltage: 1.32 V

Allows for flexibility in power supply options while still maintaining stable performance.

Bit Size: 32

Offers a high level of processing power and capability for handling complex tasks efficiently.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options to accommodate different system requirements and configurations.

Maximum Operating Temperature: 105 °C

Can operate effectively in high temperature environments, making it suitable for industrial applications.

ROM Words: 1310720

Large ROM capacity allows for storing extensive program code and data, enabling versatile functionality.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial conditions, ensuring reliable performance in challenging environments.

Speed: 200 rpm

Delivers fast processing speed, enabling quick execution of instructions and tasks.

Technical Specifications

Microcontrollers RM46L840PGET attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

144

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Words:

1310720

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

RM46L840PGET Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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