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RM46L430ZWTT

Texas Instruments

RM46L430ZWTT by Texas Instruments

The Texas Instruments RM46L430ZWTT microcontroller features a 32-bit Cortex-R4F CPU with 1048576 ROM words and 131072 RAM bytes. With a max clock frequency of 80 MHz, it is suitable for industrial applications requiring high-speed processing and ADC/DMA channels for data acquisition. The microcontroller operates in temperatures ranging from -40 to 105 °C, making it ideal for robust embedded systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,869 parts In-Stock

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Digiode

USA . 197 parts In-Stock

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197

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One Stop Electronics

USA . 673 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 219 parts In-Stock

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$16.872

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Parana Technologies

USA . 525 parts In-Stock

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$21.491

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$21.871

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525

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$21.871

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DigiPath Technology Company

USA . 796 parts In-Stock

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$23.664

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$21.771

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796

$23.664

$21.771

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ChromeModa Solutions

Germany . 1,670 parts In-Stock

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$24.147

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$19.801

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1,670

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$19.801

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IDEA Electronic Components Group

UK . 1,283 parts In-Stock

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$24.147

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$22.940

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$21.732

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1,283

$24.147

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$21.732

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Corphita

USA . 1,107 parts In-Stock

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Microchip USA

USA . 265 parts In-Stock

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Overview

Experience the cutting-edge technology of Texas Instruments with the RM46L430ZWTT microcontroller. Designed to meet industrial demands, this powerhouse offers a wide range of applications in various industries. With a focus on precision and reliability, Texas Instruments delivers superior quality and performance. Trust in the value and benefits that this microcontroller brings to your projects, providing seamless integration and advanced capabilities. Upgrade your systems with the RM46L430ZWTT and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and reliability for the product.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the product.

Maximum Supply Voltage: 1.32 V

Higher maximum supply voltage allows for flexibility in power supply options.

Address Bus Width: 13

A wider address bus width enables the microcontroller to access larger memory spaces.

Bit Size: 32

32-bit architecture provides enhanced performance and processing capabilities.

Power Supplies (V): 1.2,3.3

Support for multiple power supply voltages allows for compatibility with various systems.

No. of Terminals: 337

Higher number of terminals provides more connectivity options.

Minimum Supply Voltage: 1.14 V

Lower minimum supply voltage helps in reducing power consumption during operation.

CPU Family: CORTEX-R4F

CORTEX-R4F family processors offer high performance and efficiency for embedded applications.

ROM Words: 1048576

Large ROM size allows for ample storage of program code and data.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices.

DMA Channels: YES

Direct Memory Access channels help in efficient data transfer and processing.

RAM Bytes: 131072

Ample RAM size enables the microcontroller to store and manipulate data during operation.

Technology: CMOS

CMOS technology provides low power consumption and high speed performance.

PWM Channels: YES

Pulse Width Modulation channels allow for precise control of analog signals.

Technical Specifications

Microcontrollers RM46L430ZWTT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

13

Bit Size:

32

CPU Family:

CORTEX-R4F

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PBGA-B337

JESD-609 Code:

e1

Length:

16 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

337

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA337,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

131072

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Speed:

200 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

RM46L430ZWTT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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