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PCM3793RHBTG4

Texas Instruments

PCM3793RHBTG4 by Texas Instruments

PCM3793RHBTG4 by Texas Instruments is a Telecom Interface IC with 32 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It operates at a nominal voltage of 3.3V, making it ideal for telecom circuit applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,793 parts In-Stock

1+ parts

-

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6,793

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Digiode

USA . 2,297 parts In-Stock

1+ parts

-

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2,297

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 483 parts In-Stock

1+ parts

$9.345

100+ parts

-

1k+ parts

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483

$9.345

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Parana Technologies

USA . 260 parts In-Stock

1+ parts

$15.716

100+ parts

$1,459.434

1k+ parts

$14.144

10k+ parts

-

260

$15.716

$1,459.434

$14.144

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DigiPath Technology Company

USA . 2,034 parts In-Stock

1+ parts

$17.305

100+ parts

-

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10k+ parts

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2,034

$17.305

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ChromeModa Solutions

Germany . 2,645 parts In-Stock

1+ parts

$17.658

100+ parts

$14.480

1k+ parts

-

10k+ parts

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2,645

$17.658

$14.480

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IDEA Electronic Components Group

UK . 43 parts In-Stock

1+ parts

$17.658

100+ parts

$16.775

1k+ parts

$15.892

10k+ parts

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43

$17.658

$16.775

$15.892

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One Stop Electronics

USA . 481 parts In-Stock

1+ parts

$362.000

100+ parts

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481

$362.000

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Corphita

USA . 1,905 parts In-Stock

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1,905

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Overview

Experience unparalleled quality and reliability with the PCM3793RHBTG4 by Texas Instruments, a leading manufacturer in the industry. This cutting-edge telecom interface IC offers seamless connectivity and enhanced performance for a wide range of applications. With its innovative technology and industrial-grade design, this product ensures optimal functionality in any environment. Discover the value and benefits that this top-of-the-line IC brings to your projects, providing you with a competitive edge and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design.

Package Shape: SQUARE

Square shape package offers efficient use of space on a circuit board.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology provides low power consumption and high speed operation.

Nominal Supply Voltage: 3.3 V

Operating at 3.3V nominal supply voltage is common in many telecom applications.

Technical Specifications

Other Function Telecom Interface ICs PCM3793RHBTG4 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

PCM3793RHBTG4 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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