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PCM3793ARHB

Texas Instruments

PCM3793ARHB by Texas Instruments

PCM3793ARHB by Texas Instruments is a telecom interface IC with 32 terminals in a square chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial applications. With a nominal voltage of 3.3V and CMOS technology, it is ideal for telecom circuits requiring high performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,776 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,776

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Vyrian

USA . 2,784 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,784

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 652 parts In-Stock

1+ parts

$8.779

100+ parts

-

1k+ parts

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10k+ parts

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652

$8.779

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Parana Technologies

USA . 1,781 parts In-Stock

1+ parts

$10.455

100+ parts

-

1k+ parts

$10.970

10k+ parts

-

1,781

$10.455

-

$10.970

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DigiPath Technology Company

USA . 326 parts In-Stock

1+ parts

$11.512

100+ parts

$10.591

1k+ parts

-

10k+ parts

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326

$11.512

$10.591

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ChromeModa Solutions

Germany . 5,921 parts In-Stock

1+ parts

$11.747

100+ parts

$9.633

1k+ parts

-

10k+ parts

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5,921

$11.747

$9.633

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IDEA Electronic Components Group

UK . 79 parts In-Stock

1+ parts

$11.747

100+ parts

$11.160

1k+ parts

$10.572

10k+ parts

-

79

$11.747

$11.160

$10.572

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Ampacity Inc.

Singapore . 1,069 parts In-Stock

1+ parts

$251.000

100+ parts

-

1k+ parts

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1,069

$251.000

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One Stop Electronics

USA . 1,137 parts In-Stock

1+ parts

$303.000

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1,137

$303.000

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Corphita

USA . 3,158 parts In-Stock

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3,158

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Overview

Experience the superior quality and reliability of the PCM3793ARHB by Texas Instruments, a leading manufacturer in the industry. This versatile telecom interface IC offers a wide range of applications in various functions, providing customers with unmatched value and benefits. Whether it's ensuring seamless communication or enhancing performance, this product delivers exceptional results. Trust Texas Instruments for cutting-edge technology and innovative solutions that meet your needs. Choose the PCM3793ARHB for unparalleled performance and reliability in your telecom interface applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides a lightweight and durable housing for the product.

Surface Mount: YES

Being surface mountable makes the product easy to install on a circuit board, saving space and simplifying assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 32

Having 32 terminals provides ample connectivity options for various telecom interfaces and devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the product can reliably function in industrial environments with varying temperatures.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40 °C) ensures the product can perform in extreme cold conditions without any issues.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance, ensuring long-term reliability.

Technology: CMOS

The CMOS technology used in the product allows for low power consumption and high-speed operation, making it energy-efficient and performance-oriented.

Nominal Supply Voltage: 3.3 V

Operates at a nominal supply voltage of 3.3 V, making it compatible with various power sources and reducing the need for external voltage regulation.

Technical Specifications

Other Function Telecom Interface ICs PCM3793ARHB attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

PCM3793ARHB Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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